5SGSED8N2F45C3G

The 5SGSED8N2F45C3G is a Stratix V GS field-programmable gate array (FPGA) in a high pin-count FCBGA package. It provides substantial on-chip logic and memory capacity along with a large I/O complement for designs that require dense programmable logic and broad external interfacing.

Designed for commercial-grade applications, this device combines high logic element count, approximately 51.2 Mbits of embedded RAM and 840 I/Os to address complex digital processing, data-path acceleration and system integration challenges where on-chip resources and connectivity density are critical.

Key Features

• Core Logic  695,000 logic elements for implementing large, complex FPGA designs.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM to support large buffers, LUT-based storage and data-path functions.
• High I/O Count  840 I/Os to enable extensive external device interfacing and parallel connectivity.
• Power Supply  Core voltage supply range: 820 mV to 880 mV for defined power budgeting and board design.
• Package & Mounting  1932-BBGA, FCBGA package (supplier package: 1932-FBGA, FC 45×45) with surface-mount mounting type for high-pin-count board implementations.
• Operating Grade & Temperature  Commercial grade device rated for operation from 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant.

Typical Applications

• High-density digital systems  Implements large-scale logic functions and complex state machines using the device's high logic-element count and on-chip memory.
• Networking and communications equipment  Supports dense protocol interfacing and parallel data paths with 840 I/Os and substantial embedded RAM for buffering.
• Data processing and acceleration  Enables custom data-path acceleration and buffering using the device's large logic and memory resources.
• System integration and prototyping  High pin-count FCBGA package and extensive I/O make the device suitable for integrating multiple subsystems on a single FPGA platform.

Unique Advantages

• High logic capacity: Delivers 695,000 logic elements to accommodate complex designs without partitioning across multiple devices.
• Significant on-chip RAM: Approximately 51.2 Mbits of embedded memory reduces dependence on external memory and simplifies board design.
• Extensive external connectivity: 840 I/Os provide flexibility for dense interface requirements and parallel data channels.
• Defined power envelope: Core voltage specification (820–880 mV) enables predictable power planning and thermal considerations.
• Compact, high-pin-count package: 1932-BBGA FCBGA (45×45) supports high-density routing in surface-mount board layouts.
• Commercial-grade reliability and compliance: Rated for 0 °C to 85 °C and RoHS compliant for standard commercial deployments.

Why Choose 5SGSED8N2F45C3G?

The 5SGSED8N2F45C3G positions itself where high logic density, large on-chip RAM and broad I/O connectivity are required in commercial environments. Its combination of 695,000 logic elements, approximately 51.2 Mbits of embedded memory and 840 I/Os makes it well suited for complex digital processing, data-path acceleration and high-density system integration.

Backed by Stratix V device documentation and datasheet specifications, this device is appropriate for design teams seeking a scalable, well-documented FPGA platform for advanced commercial applications that demand significant on-chip resources and connectivity.

Request a quote or submit a pricing inquiry for the 5SGSED8N2F45C3G to discuss availability and quantities for your design requirements.