5SGSED8N2F45I2G

IC FPGA 840 I/O 1932FBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 840 51200000 695000 1932-BBGA, FCBGA

Quantity 771 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1932-FBGA, FC (45x45)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1932-BBGA, FCBGANumber of I/O840Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs262400Number of Logic Elements/Cells695000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits51200000

Overview of 5SGSED8N2F45I2G – Stratix® V GS FPGA, 695000 logic elements, ~51.2 Mbits RAM, 840 I/Os

The 5SGSED8N2F45I2G is a Stratix® V GS field programmable gate array (FPGA) device in an industrial-grade package. It delivers high logic density, substantial on-chip embedded memory, and a large I/O count in a 1932-BBGA FCBGA footprint for complex, high‑integration digital designs.

Targeted at designs that require large programmable logic capacity and broad I/O connectivity, this device combines dense logic resources with a wide operating temperature range and a low-voltage core supply to support demanding industrial applications.

Key Features

  • Core Logic  695000 logic elements to implement complex digital functions and custom hardware acceleration.
  • Embedded Memory  Approximately 51.2 Mbits of on‑chip RAM for buffering, state storage, and local data processing.
  • I/O Capacity  840 general-purpose I/O pins to support dense interfacing and multi-channel connectivity.
  • Power Supply  Core voltage supply range of 870 mV to 930 mV to match low-voltage system rails.
  • Package and Mounting  1932-BBGA FCBGA package (supplier package: 1932-FBGA, FC 45×45) with surface-mount mounting type for high-density PCB integration.
  • Temperature Range  Industrial operating temperature from −40 °C to 100 °C suitable for extended-environment deployments.
  • Regulatory  RoHS compliant for lead-free manufacturing processes.

Typical Applications

  • Industrial Control and Automation  High logic density and broad I/O count support complex control algorithms, sensor aggregation, and real-time decision logic across industrial systems.
  • Telecommunications and Networking  Large embedded memory and abundant I/O enable packet buffering, protocol processing, and dense interface implementations.
  • High‑Density Signal Processing  Substantial logic resources and on-chip RAM provide capacity for parallel data paths, DSP pipelines, and custom accelerators.

Unique Advantages

  • High Logic Capacity: 695000 logic elements enable implementation of large-scale, custom hardware functions without partitioning across multiple devices.
  • Significant On‑Chip Memory: Approximately 51.2 Mbits of embedded RAM reduces the need for external memory in many buffering and processing tasks.
  • Large I/O Count: 840 I/Os simplify board-level connectivity for multi-channel interfaces and high-pin-count systems.
  • Industrial‑Grade Operation: −40 °C to 100 °C operating range supports deployment in extended-temperature environments.
  • Compact, High‑Density Package: 1932-BBGA FCBGA package provides a high pin count in a compact footprint for dense PCB designs.
  • RoHS Compliant: Meets lead‑free manufacturing requirements for regulatory and process consistency.

Why Choose 5SGSED8N2F45I2G?

The 5SGSED8N2F45I2G positions itself as a high‑density, industrial‑grade Stratix V GS FPGA for engineers who need large programmable logic, plentiful embedded memory, and extensive I/O in a single device. Its combination of 695000 logic elements, roughly 51.2 Mbits of on‑chip RAM, and 840 I/Os provides the building blocks required for complex signal processing, protocol handling, and control logic without fragmenting functionality across multiple components.

With a low-voltage core supply range and an industrial operating temperature window, this device is suited to robust system designs that demand reliable operation in extended environments while maintaining high integration and board-level density.

Request a quote or submit an inquiry to discuss availability, pricing, and how the 5SGSED8N2F45I2G can be applied to your next high-density FPGA design.

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