5SGSED8N2F45I2G
| Part Description |
Stratix® V GS Field Programmable Gate Array (FPGA) IC 840 51200000 695000 1932-BBGA, FCBGA |
|---|---|
| Quantity | 771 Available (as of May 6, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1932-FBGA, FC (45x45) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1932-BBGA, FCBGA | Number of I/O | 840 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 262400 | Number of Logic Elements/Cells | 695000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 51200000 |
Overview of 5SGSED8N2F45I2G – Stratix® V GS FPGA, 695000 logic elements, ~51.2 Mbits RAM, 840 I/Os
The 5SGSED8N2F45I2G is a Stratix® V GS field programmable gate array (FPGA) device in an industrial-grade package. It delivers high logic density, substantial on-chip embedded memory, and a large I/O count in a 1932-BBGA FCBGA footprint for complex, high‑integration digital designs.
Targeted at designs that require large programmable logic capacity and broad I/O connectivity, this device combines dense logic resources with a wide operating temperature range and a low-voltage core supply to support demanding industrial applications.
Key Features
- Core Logic 695000 logic elements to implement complex digital functions and custom hardware acceleration.
- Embedded Memory Approximately 51.2 Mbits of on‑chip RAM for buffering, state storage, and local data processing.
- I/O Capacity 840 general-purpose I/O pins to support dense interfacing and multi-channel connectivity.
- Power Supply Core voltage supply range of 870 mV to 930 mV to match low-voltage system rails.
- Package and Mounting 1932-BBGA FCBGA package (supplier package: 1932-FBGA, FC 45×45) with surface-mount mounting type for high-density PCB integration.
- Temperature Range Industrial operating temperature from −40 °C to 100 °C suitable for extended-environment deployments.
- Regulatory RoHS compliant for lead-free manufacturing processes.
Typical Applications
- Industrial Control and Automation High logic density and broad I/O count support complex control algorithms, sensor aggregation, and real-time decision logic across industrial systems.
- Telecommunications and Networking Large embedded memory and abundant I/O enable packet buffering, protocol processing, and dense interface implementations.
- High‑Density Signal Processing Substantial logic resources and on-chip RAM provide capacity for parallel data paths, DSP pipelines, and custom accelerators.
Unique Advantages
- High Logic Capacity: 695000 logic elements enable implementation of large-scale, custom hardware functions without partitioning across multiple devices.
- Significant On‑Chip Memory: Approximately 51.2 Mbits of embedded RAM reduces the need for external memory in many buffering and processing tasks.
- Large I/O Count: 840 I/Os simplify board-level connectivity for multi-channel interfaces and high-pin-count systems.
- Industrial‑Grade Operation: −40 °C to 100 °C operating range supports deployment in extended-temperature environments.
- Compact, High‑Density Package: 1932-BBGA FCBGA package provides a high pin count in a compact footprint for dense PCB designs.
- RoHS Compliant: Meets lead‑free manufacturing requirements for regulatory and process consistency.
Why Choose 5SGSED8N2F45I2G?
The 5SGSED8N2F45I2G positions itself as a high‑density, industrial‑grade Stratix V GS FPGA for engineers who need large programmable logic, plentiful embedded memory, and extensive I/O in a single device. Its combination of 695000 logic elements, roughly 51.2 Mbits of on‑chip RAM, and 840 I/Os provides the building blocks required for complex signal processing, protocol handling, and control logic without fragmenting functionality across multiple components.
With a low-voltage core supply range and an industrial operating temperature window, this device is suited to robust system designs that demand reliable operation in extended environments while maintaining high integration and board-level density.
Request a quote or submit an inquiry to discuss availability, pricing, and how the 5SGSED8N2F45I2G can be applied to your next high-density FPGA design.

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