5SGSED8N2F45I2LG

The 5SGSED8N2F45I2LG is an Intel Stratix V GS Field Programmable Gate Array (FPGA) offered in a 1932-BBGA FCBGA package. It delivers large programmable logic capacity, substantial embedded RAM, and a high I/O count in an industrial-grade device.

With 695,000 logic elements and approximately 51.2 Mbits of on-chip RAM, this Stratix V GS device is targeted at applications that require dense logic integration, extensive I/O connectivity, and operation across an industrial temperature range. The device’s low-voltage core supply and FCBGA package support compact, surface-mount systems.

Key Features

• Core & Logic – 695,000 logic elements provide a high-density programmable fabric for complex logic, algorithm acceleration, and large-scale digital designs.
• Embedded Memory – Approximately 51.2 Mbits of total on-chip RAM to support buffers, FIFOs, and on-chip data storage for latency-sensitive processing.
• I/O Capacity – 840 user I/Os enable extensive parallel connectivity for high-pin-count boards, dense front-panel interfaces, and multi-channel systems.
• Package & Mounting – 1932-BBGA (FCBGA, 45×45) supplier device package designed for surface-mount assembly and high-density PCB routing.
• Power Supply – Core voltage supply range of 820 mV to 880 mV for the device core.
• Industrial Temperature Grade – Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
• Regulatory Compliance – RoHS compliant.

Typical Applications

• Industrial Control & Automation – Use for high-channel-count I/O, real-time processing, and control logic in industrial equipment and factory automation.
• Telecommunications & Networking – Suitable for dense packet-processing, protocol bridging, and high-pin-count interface designs requiring significant on-chip memory.
• Data Acquisition & Signal Processing – Implement signal conditioning, aggregation, and deterministic processing where large logic capacity and embedded RAM are required.
• High-Performance Embedded Systems – Integrate custom accelerators and complex state machines in compact, surface-mount FPGA-based modules.

Unique Advantages

• High integration density: 695,000 logic elements and substantial on-chip RAM reduce external components and simplify board-level design.
• Extensive I/O count: 840 I/Os allow direct connection to numerous peripherals and high-channel-count front ends without intermediate multiplexing.
• Industrial robustness: −40 °C to 100 °C operating range and industrial grade enable deployment in harsh and temperature-variable environments.
• Compact FCBGA packaging: 1932-BBGA package supports dense PCB routing and surface-mount assembly for space-constrained systems.
• Controlled core power: Narrow core voltage range (820 mV–880 mV) supports predictable power budgeting and thermal planning.
• Standards-compliant materials: RoHS compliance supports regulatory requirements for electronic assemblies.

Why Choose 5SGSED8N2F45I2LG?

The 5SGSED8N2F45I2LG positions itself as a high-density, industrial-grade Stratix V GS FPGA for designs that demand large programmable logic capacity, substantial embedded memory, and abundant I/O in a surface-mount FCBGA package. Its combination of 695,000 logic elements, approximately 51.2 Mbits of on-chip RAM, and 840 I/Os makes it well suited for complex processing, real-time control, and high-channel-count interface applications.

Designed by Intel for systems requiring scalability and rugged operation, this device is appropriate for engineering teams building compact, high-performance embedded platforms where integration, thermal planning, and industrial temperature operation are priorities.

Request a quote or submit an inquiry to purchase the 5SGSED8N2F45I2LG and receive detailed ordering and availability information.