5SGSED8N2F45I2LN

The 5SGSED8N2F45I2LN is a Stratix® V GS field programmable gate array (FPGA) offering a high-density, DSP-oriented architecture in a 1932-ball BGA (FCBGA) package. Built on the Stratix V family platform, this device targets transceiver-enabled, compute-intensive applications where large logic capacity and abundant embedded memory are required.

With 695,000 logic elements, approximately 51.2 Mbits of embedded memory, and integrated transceiver and DSP resources described for the Stratix V GS variant, this device supports high-bandwidth and DSP-centric designs across wireline, broadcast, military, and high-performance computing markets.

Key Features

• Core & Process — Stratix V family architecture built on 28‑nm TSMC process technology with an adaptive logic module-based fabric.
• Logic Capacity — 695,000 logic elements to implement large-scale digital designs.
• Embedded Memory — Approximately 51.2 Mbits of on-chip RAM (Total Ram Bits: 51,200,000) for buffering, packet processing, and data staging.
• DSP Resources — Stratix V GS devices include variable-precision DSP blocks, supporting up to 3,926 18×18 or 1,963 27×27 multipliers for high-precision signal processing workloads.
• High-Speed Transceivers — GS variant provides integrated transceivers with 14.1 Gbps data-rate capability for backplane and optical interfaces.
• I/O & Package — Up to 840 user I/Os in a 1932‑BBGA FCBGA (45×45 mm) package for dense board-level integration.
• Power — Core voltage supply range 820 mV to 880 mV.
• Thermal & Grade — Industrial grade operation from −40 °C to 100 °C and surface-mount package mounting.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Optical and Ethernet Transport — Suitable for 40G/100G class interfaces and packet processing where high-speed transceivers and large buffering are required.
• DSP-Centric Processing — High-precision signal processing for broadcast, wireless test systems, and compute-intensive algorithms using the device’s abundant DSP multipliers.
• High-Performance Computing — Accelerator and data-path implementations benefiting from large logic capacity and significant on‑chip RAM.
• Wireline and Military Communications — Backplane and optical interface applications leveraging integrated 14.1 Gbps transceivers and industrial temperature rating.

Unique Advantages

• High logic density: 695,000 logic elements provide headroom for complex SoC-style FPGA designs and large control/data-path implementations.
• Significant on-chip RAM: Approximately 51.2 Mbits of embedded memory reduces external memory dependency and simplifies board-level BOM.
• DSP-optimized architecture: Variable-precision DSP blocks supporting thousands of multipliers enable efficient implementation of high-throughput signal-processing pipelines.
• Integrated high-speed I/O: 840 I/Os and 14.1 Gbps transceiver capability support dense, high-bandwidth interfacing to optical and backplane systems.
• Industrial temperature range: −40 °C to 100 °C rating supports deployment in demanding environments.
• Prototyping to ASIC path: Part of the Stratix V family, which provides a documented low-risk path to HardCopy® V ASICs for production transition.

Why Choose 5SGSED8N2F45I2LN?

The 5SGSED8N2F45I2LN combines substantial logic capacity, abundant embedded memory, and DSP/transceiver resources in a single industrial‑rated FCBGA package—making it well suited for transceiver-based, DSP-centric and high-bandwidth designs. Its feature set aligns with applications that demand large on-chip resources and high-speed interfaces while retaining the ability to prototype and migrate to HardCopy V ASICs for production scalability.

To request pricing or availability, submit a quote request or contact sales to discuss your design requirements and lead times.