5SGSED8N2F45I3L

The 5SGSED8N2F45I3L is a Stratix V GS field-programmable gate array (FPGA) IC from Intel. It delivers high logic capacity and extensive I/O in a 1932-ball FCBGA package targeted for industrial-grade applications.

With 695,000 logic elements and approximately 51.2 Mbits of embedded memory, this device is designed for designs that require dense programmable logic, large on-chip RAM, and wide external connectivity while operating across an industrial temperature range.

Key Features

• Logic Capacity — 695,000 logic elements to implement complex digital systems and high-density logic functions.
• Embedded Memory — Approximately 51.2 Mbits of on-chip RAM for buffering, LUTs, and state storage.
• I/O Density — 840 user I/Os to support extensive peripheral, sensor, and interface connectivity.
• Power and Core Voltage — Core supply range of 820 mV to 880 mV to match system power-rail requirements for Stratix V devices.
• Package and Mounting — 1932-BBGA (FCBGA) in a 45 × 45 mm supplier device package, surface-mount mounting type for board-level integration.
• Industrial Grade and Temperature Range — Grade: Industrial; specified operating temperature from −40 °C to 100 °C for deployment in harsh environments.
• Standards & Compliance — RoHS compliant, supporting regulatory lead-free requirements.

Typical Applications

• Industrial Control Systems — Use the device’s industrial grade and wide temperature range for control logic, deterministic I/O handling, and on-board processing in factory automation equipment.
• High-Density I/O Aggregation — Leverage 840 I/Os and large logic capacity for multi-channel sensor aggregation, protocol bridging, and deterministic I/O routing.
• Embedded Processing & Acceleration — Deploy the substantial logic and embedded memory for custom acceleration tasks, real-time data processing, and complex state machines within embedded platforms.

Unique Advantages

• Large Programmable Fabric: 695,000 logic elements enable implementation of complex, large-scale digital designs without external glue logic.
• Substantial On-Chip RAM: Approximately 51.2 Mbits of embedded memory reduces reliance on external memory for buffering and state retention.
• Extensive I/O Capability: 840 I/Os support multiple parallel interfaces, sensors, and peripherals, simplifying board-level routing and system integration.
• Industrial Reliability: Industrial grade and −40 °C to 100 °C operating range allow deployment in temperature-demanding environments.
• Compact FCBGA Packaging: 1932-BBGA FCBGA (45 × 45 mm) balances high pin count with a board-space-efficient footprint and surface-mount assembly.
• Regulatory Compliance: RoHS compliant for lead-free manufacturing processes.

Why Choose 5SGSED8N2F45I3L?

The 5SGSED8N2F45I3L combines substantial logic density, large embedded memory, and high I/O count in a rugged industrial-grade Stratix V GS device. Its core voltage window and package choices make it suitable for designers needing a highly integrated FPGA solution that fits into surface-mount production flows.

This part is appropriate for engineering teams building complex embedded systems that require scalable programmable logic, significant on-chip RAM, and broad external connectivity while meeting industrial temperature and RoHS requirements.

If you would like pricing, availability, or to request a quote for the 5SGSED8N2F45I3L, submit an inquiry or request a quote through your preferred procurement channel.