5SGSED8N2F45I3LN

The 5SGSED8N2F45I3LN is an Intel Stratix V GS family FPGA offered in a 1932-BBGA FCBGA package for surface-mount applications. This industrial-grade device provides a large logic resource set, extensive on-chip memory, and a high I/O count for complex digital designs that require substantial integration and connectivity.

Designed for use across temperature extremes, the device operates from -40 °C to 100 °C and is RoHS compliant, making it suitable for demanding embedded and industrial environments where reliability and long-term availability are important.

Key Features

• Core Logic  695,000 logic elements provide significant programmable fabric for complex FPGA implementations.
• Embedded Memory  Approximately 51 Mbits of embedded memory (51,200,000 bits) for on-chip storage, buffering, and data path implementations.
• I/O Capacity  840 device I/O pins enable dense external connectivity and flexible interfacing to peripherals and subsystems.
• Power Supply  Core voltage supply range from 820 mV to 880 mV to support the specified operating conditions.
• Package & Mounting  1932-BBGA (FCBGA) package; supplier device package listed as 1932-FBGA, FC (45×45). Surface mount mounting type supports standard PCB assembly processes.
• Temperature & Grade  Industrial temperature grade with an operating range of -40 °C to 100 °C for robust operation in harsh environments.
• Compliance  RoHS compliant.

Typical Applications

• High-density digital processing  Large-scale logic capacity and embedded memory make the device suitable for compute-intensive FPGA tasks and custom processors.
• High-pin-count system integration  840 I/O pins enable integration with multiple high-speed interfaces, sensors, and peripherals in complex systems.
• Industrial embedded systems  Industrial temperature rating and surface-mount packaging allow deployment in factory automation, instrumentation, and control equipment.

Unique Advantages

• Substantial programmable fabric: 695,000 logic elements support large, multi-function designs and permit consolidation of multiple subsystems onto a single device.
• Generous on-chip memory: Approximately 51 Mbits of embedded memory reduces dependence on external memory for buffering and accelerators.
• Extensive I/O resources: 840 I/O pins provide flexibility for dense board-level connectivity, minimizing the need for external I/O expanders.
• Industrial thermal range: Qualified for operation from -40 °C to 100 °C to meet demanding environmental requirements.
• Surface-mount, high-pin-count package: 1932-BBGA (45×45) packaging supports compact, high-density PCB designs while enabling reliable assembly.
• Regulatory readiness: RoHS compliance helps simplify compliance planning for regulated product lines.

Why Choose 5SGSED8N2F45I3LN?

The 5SGSED8N2F45I3LN combines large-scale programmable logic, substantial on-chip memory, and high I/O capacity in an industrial-grade Stratix V GS FPGA. Its package and surface-mount form factor suit high-density board layouts, while the wide operating temperature range supports deployment in challenging environments.

This device is appropriate for teams designing complex digital systems that require integration of multiple functions, high connectivity, and robust thermal performance. The combination of logic capacity, embedded memory, and I/O resources delivers long-term value for scalable, high-function FPGA-based solutions.

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