5SGSED8N2F45I3N

The 5SGSED8N2F45I3N is a Stratix® V GS Field Programmable Gate Array (FPGA) in a 1932-BBGA FCBGA package. It delivers high on-chip capacity with 695,000 logic elements and approximately 51.2 Mbits of embedded RAM, along with a large 840‑pin I/O complement.

Specified for industrial operation and designed for surface-mount assembly, this device targets designs that require substantial programmable logic density, significant embedded memory, and a high I/O count within a 45×45 supplier package footprint. Electrical and switching characteristics for the Stratix V family are documented in the Stratix V device datasheet.

Key Features

• Core capacity  Approximately 695,000 logic elements to support complex programmable logic and large-scale integration on a single device.
• Embedded memory  Approximately 51.2 Mbits of on-chip RAM for buffering, state storage, and memory-intensive logic functions.
• I/O resources  840 user I/Os for broad external connectivity and interfacing to high-pin-count systems.
• Package and mounting  1932-BBGA FCBGA supplier package (1932-FBGA, FC 45×45) with surface-mount mounting type for compact board-level integration.
• Power supply  Core voltage range specified from 820 mV to 880 mV to align with the device’s power requirements.
• Temperature and grade  Industrial grade with an operating temperature range of −40°C to 100°C for deployment in temperature-demanding environments.
• Regulatory  RoHS compliant.

Typical Applications

• High-density programmable logic  Large-scale designs that require extensive logic resources and embedded memory can consolidate functions onto this device.
• High I/O systems  Systems needing broad external connectivity and multi‑lane interfacing benefit from the 840 available I/Os.
• Industrial equipment  Industrial-grade temperature range makes the device suitable for applications that operate between −40°C and 100°C.

Unique Advantages

• High logic integration: The device’s ~695,000 logic elements enable consolidation of complex functions into a single FPGA, reducing board-level partitioning.
• Substantial on-chip memory: Approximately 51.2 Mbits of embedded RAM supports large buffers, LUT-based storage, and memory-hungry algorithms without immediate reliance on external memory.
• Extensive I/O resources: 840 user I/Os provide flexibility for wide parallel interfaces, multiple peripheral connections, and high-pin-count system designs.
• Industrial temperature rating: Specified operating range of −40°C to 100°C supports deployment in temperature-challenging environments.
• Compact FCBGA package: 1932-BBGA / 1932-FBGA (45×45) package supports high pin density in a board-space efficient form factor for surface-mount assembly.
• Low-voltage core: Core supply range of 820–880 mV aligns with modern low-voltage FPGA power domains.

Why Choose 5SGSED8N2F45I3N?

The 5SGSED8N2F45I3N combines extensive logic capacity, substantial embedded memory, and a high I/O count in a compact 1932‑BBGA FCBGA package. Its industrial temperature rating and RoHS compliance make it suitable for demanding deployments where on-chip resources and reliability matter.

This device is well suited for engineering teams and procurement groups building high-density programmable logic systems that require consolidated functionality, large on-chip storage, and broad connectivity while maintaining a surface-mount board-level footprint.

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