5SGSED8N2F45I3LG

The 5SGSED8N2F45I3LG is an Intel Stratix® V GS Field Programmable Gate Array (FPGA) IC offering high logic density and substantial on-chip memory. This surface-mount FCBGA device provides 695,000 logic elements and approximately 51.2 Mbits of embedded memory for demanding programmable logic designs.

With 840 general-purpose I/Os, industrial temperature grading, and a low core-voltage operating range, this device targets applications that require dense logic, large memory resources, and robust I/O capacity within a compact 1932-ball BGA package.

Key Features

• Core Logic  695,000 logic elements to implement complex digital functions and high-density logic architectures.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM to support buffering, large lookup tables, and state storage without external memory.
• I/O Capacity  840 I/O pins for extensive peripheral interfacing, multi-channel data paths, and high-pin-count board designs.
• Power Supply  Core operating voltage range of 820 mV to 880 mV for the device core supply.
• Package & Mounting  1932-BBGA FCBGA package; supplier device package listed as 1932-FBGA, FC (45×45). Surface-mount mounting type for compact PCB integration.
• Temperature & Grade  Industrial grade operation with an operating temperature range of –40 °C to 100 °C for deployment in harsh environments.
• Compliance  RoHS-compliant to meet environmental and regulatory requirements.

Typical Applications

• High-density digital processing  Implement large-scale algorithms and datapaths using 695,000 logic elements and extensive on-chip RAM.
• Multi-channel I/O systems  Support complex front-end interfaces and parallel data lanes with 840 available I/Os.
• Memory-intensive functions  Use approximately 51.2 Mbits of embedded memory for buffering, lookup tables, and state retention without immediate external memory.

Unique Advantages

• High logic density: 695,000 logic elements provide the capacity to integrate complex functions that would otherwise require multiple devices.
• Substantial embedded memory: Approximately 51.2 Mbits of on-chip RAM reduces dependence on external memory and simplifies board-level design.
• Extensive I/O connectivity: 840 I/Os enable broad peripheral interfacing and flexible system partitioning on a single device.
• Industrial temperature range: Rated from –40 °C to 100 °C for reliability in temperature-challenging installations.
• Compact FCBGA packaging: 1932-ball FBGA (45×45) package supports high pin count in a compact footprint for dense PCBs.
• Regulatory compliance: RoHS-compliant for alignment with environmental supply-chain requirements.

Why Choose 5SGSED8N2F45I3LG?

The 5SGSED8N2F45I3LG positions itself where high logic capacity, significant embedded memory, and wide I/O counts are required in a single, industrial-grade FPGA. Its combination of 695,000 logic elements, approximately 51.2 Mbits of on-chip RAM, and 840 I/Os supports consolidation of complex designs and reduces system-level component count.

Engineers specifying this Stratix V GS device gain a compact FCBGA package and predictable operating parameters (820–880 mV core voltage, –40 °C to 100 °C operation) backed by Intel Stratix V device documentation and datasheet guidance.

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