5SGSED8N2F45I2N
| Part Description |
Stratix® V GS Field Programmable Gate Array (FPGA) IC 840 51200000 695000 1932-BBGA, FCBGA |
|---|---|
| Quantity | 246 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1932-FBGA, FC (45x45) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1932-BBGA, FCBGA | Number of I/O | 840 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 262400 | Number of Logic Elements/Cells | 695000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 51200000 |
Overview of 5SGSED8N2F45I2N – Stratix® V GS FPGA, 695,000 logic elements, ~51.2 Mbits RAM, 840 I/Os
The 5SGSED8N2F45I2N is an Intel Stratix® V GS field-programmable gate array (FPGA) designed for DSP-centric, transceiver-enabled applications. It combines a high logic element count with substantial on-chip memory and a large I/O complement to address compute- and bandwidth-intensive system functions.
Built on the Stratix V architecture, this GS-class device provides variable-precision DSP resources and integrated transceivers targeted at wireline, broadcast, military, and high-performance computing applications, while offering industrial-grade operating range and a 1932-BBGA surface-mount package for board-level integration.
Key Features
- Logic Fabric Approximately 695,000 logic elements provide the programmable fabric for complex control, signal processing, and protocol implementations.
- Embedded Memory Approximately 51.2 Mbits of on-chip RAM supports large buffering, packet processing, and intermediate storage for DSP pipelines.
- DSP Resources GS-family variable-precision DSP blocks enable dense multiply-accumulate implementations; the Stratix V GS variant is optimized for DSP-centric workloads.
- High-speed Transceivers Stratix V GS devices include integrated transceivers with multi-gigabit capability suitable for backplane and optical interface applications.
- I/O Density 840 I/Os allow flexible interfacing to high-pin-count peripherals, mezzanines, and multi-lane serial links.
- Power and Voltage Core supply range from 870 mV to 930 mV aligns with Stratix V core-voltage requirements.
- Package and Mounting 1932-BBGA (FCBGA) supplier package, 45 × 45 mm footprint, surface-mount for high-density board designs.
- Operating Range & Grade Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in demanding environments.
- Architectural Building Blocks Includes adaptive logic modules (ALMs), 20-Kbit M20K embedded memory blocks, fractional PLLs, and an Embedded HardCopy Block for hardened IP instantiation.
Typical Applications
- High-performance DSP Systems Dense DSP blocks and large on-chip RAM make the device suitable for real-time signal-processing pipelines and compute-heavy algorithms.
- Backplane and Optical Interfaces Integrated multi-gigabit transceivers and high I/O count support backplane connectivity and optical transport front ends.
- Broadcast and Media Processing On-chip memory and DSP resources enable frame buffering, encoding/decoding, and multi-channel media workflows.
- Military and Wireline Communications Industrial temperature rating and transceiver-capable fabric support rugged communications and networking equipment.
Unique Advantages
- High Logic and Memory Density: Combines ~695k logic elements with ~51.2 Mbits of embedded RAM to support complex designs without excessive external memory.
- DSP-Optimized Variant: GS-class architecture targets variable-precision DSP workloads, reducing design effort for signal-processing functions.
- Transceiver Integration: Built-in high-speed transceivers reduce board-level SerDes complexity for multi-gigabit links and optical interfaces.
- Industrial Temperature Range: Rated −40 °C to 100 °C for deployment in environments requiring extended thermal performance.
- Production Path to HardCopy ASICs: Embedded HardCopy Block enables a low-risk, lower-cost migration path to ASIC hardening where applicable.
- Compact, High‑Pin Package: 1932-BBGA surface-mount package supports high I/O density in a 45 × 45 mm footprint for space-constrained boards.
Why Choose 5SGSED8N2F45I2N?
The 5SGSED8N2F45I2N positions itself where high DSP throughput, large on-chip memory, and extensive I/O are required within an industrial-temperature FPGA. Its Stratix V GS architecture couples dense logic resources and variable-precision DSP blocks with integrated transceivers to address demanding signal-processing and communication workloads.
This device is suited to engineers and programs seeking a production-ready FPGA with a clear migration path to hardened ASICs, a wide operating range, and the package density needed for modern, high-bandwidth systems.
Request a quote or submit an inquiry for pricing and availability to evaluate the 5SGSED8N2F45I2N for your next design.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018