5SGSED8N2F45I2N

IC FPGA 840 I/O 1932FBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 840 51200000 695000 1932-BBGA, FCBGA

Quantity 246 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1932-FBGA, FC (45x45)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1932-BBGA, FCBGANumber of I/O840Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs262400Number of Logic Elements/Cells695000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits51200000

Overview of 5SGSED8N2F45I2N – Stratix® V GS FPGA, 695,000 logic elements, ~51.2 Mbits RAM, 840 I/Os

The 5SGSED8N2F45I2N is an Intel Stratix® V GS field-programmable gate array (FPGA) designed for DSP-centric, transceiver-enabled applications. It combines a high logic element count with substantial on-chip memory and a large I/O complement to address compute- and bandwidth-intensive system functions.

Built on the Stratix V architecture, this GS-class device provides variable-precision DSP resources and integrated transceivers targeted at wireline, broadcast, military, and high-performance computing applications, while offering industrial-grade operating range and a 1932-BBGA surface-mount package for board-level integration.

Key Features

  • Logic Fabric  Approximately 695,000 logic elements provide the programmable fabric for complex control, signal processing, and protocol implementations.
  • Embedded Memory  Approximately 51.2 Mbits of on-chip RAM supports large buffering, packet processing, and intermediate storage for DSP pipelines.
  • DSP Resources  GS-family variable-precision DSP blocks enable dense multiply-accumulate implementations; the Stratix V GS variant is optimized for DSP-centric workloads.
  • High-speed Transceivers  Stratix V GS devices include integrated transceivers with multi-gigabit capability suitable for backplane and optical interface applications.
  • I/O Density  840 I/Os allow flexible interfacing to high-pin-count peripherals, mezzanines, and multi-lane serial links.
  • Power and Voltage  Core supply range from 870 mV to 930 mV aligns with Stratix V core-voltage requirements.
  • Package and Mounting  1932-BBGA (FCBGA) supplier package, 45 × 45 mm footprint, surface-mount for high-density board designs.
  • Operating Range & Grade  Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in demanding environments.
  • Architectural Building Blocks  Includes adaptive logic modules (ALMs), 20-Kbit M20K embedded memory blocks, fractional PLLs, and an Embedded HardCopy Block for hardened IP instantiation.

Typical Applications

  • High-performance DSP Systems  Dense DSP blocks and large on-chip RAM make the device suitable for real-time signal-processing pipelines and compute-heavy algorithms.
  • Backplane and Optical Interfaces  Integrated multi-gigabit transceivers and high I/O count support backplane connectivity and optical transport front ends.
  • Broadcast and Media Processing  On-chip memory and DSP resources enable frame buffering, encoding/decoding, and multi-channel media workflows.
  • Military and Wireline Communications  Industrial temperature rating and transceiver-capable fabric support rugged communications and networking equipment.

Unique Advantages

  • High Logic and Memory Density:  Combines ~695k logic elements with ~51.2 Mbits of embedded RAM to support complex designs without excessive external memory.
  • DSP-Optimized Variant:  GS-class architecture targets variable-precision DSP workloads, reducing design effort for signal-processing functions.
  • Transceiver Integration:  Built-in high-speed transceivers reduce board-level SerDes complexity for multi-gigabit links and optical interfaces.
  • Industrial Temperature Range:  Rated −40 °C to 100 °C for deployment in environments requiring extended thermal performance.
  • Production Path to HardCopy ASICs:  Embedded HardCopy Block enables a low-risk, lower-cost migration path to ASIC hardening where applicable.
  • Compact, High‑Pin Package:  1932-BBGA surface-mount package supports high I/O density in a 45 × 45 mm footprint for space-constrained boards.

Why Choose 5SGSED8N2F45I2N?

The 5SGSED8N2F45I2N positions itself where high DSP throughput, large on-chip memory, and extensive I/O are required within an industrial-temperature FPGA. Its Stratix V GS architecture couples dense logic resources and variable-precision DSP blocks with integrated transceivers to address demanding signal-processing and communication workloads.

This device is suited to engineers and programs seeking a production-ready FPGA with a clear migration path to hardened ASICs, a wide operating range, and the package density needed for modern, high-bandwidth systems.

Request a quote or submit an inquiry for pricing and availability to evaluate the 5SGSED8N2F45I2N for your next design.

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