5SGSED8N2F45I3G

IC FPGA 840 I/O 1932FBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 840 51200000 695000 1932-BBGA, FCBGA

Quantity 926 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1932-FBGA, FC (45x45)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1932-BBGA, FCBGANumber of I/O840Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs262400Number of Logic Elements/Cells695000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits51200000

Overview of 5SGSED8N2F45I3G – Stratix® V GS FPGA, 840 I/O, ~51.2 Mbits RAM, 695,000 logic elements

The 5SGSED8N2F45I3G is a Stratix V GS field programmable gate array (FPGA) IC from Intel, offered in an industrial temperature grade. It provides a high-density logic fabric, a large pool of on-chip memory, and extensive I/O to support complex, system-level digital designs.

This device is targeted at applications that require substantial logic capacity, significant embedded RAM, and a high I/O count, delivered in a 1932-FBGA surface-mount package with industrial operating conditions.

Key Features

  • Core Logic 695,000 logic elements to implement large-scale digital designs and complex logic functions.
  • Embedded Memory Approximately 51.2 Mbits of on-chip RAM for buffering, scratchpad storage, and state retention within the FPGA fabric.
  • I/O Capacity 840 I/O pins to interface with numerous peripherals, parallel buses, or multi-lane systems on a single device.
  • Package & Mounting 1932-BBGA / 1932-FBGA (45×45) package in a surface-mount form factor for high-pin-count board integration.
  • Power Core supply range specified at 820 mV to 880 mV to match system power-rail design requirements.
  • Temperature & Grade Industrial grade with an operating range of −40 °C to 100 °C for deployment in extended-temperature environments.
  • Compliance RoHS-compliant to meet standard environmental requirements.
  • Part of the Stratix V Family Device is supported by the Stratix V device documentation and electrical characterization provided by Intel/Altera.

Typical Applications

  • Industrial control and automation Industrial temperature rating (−40 °C to 100 °C) and extensive I/O count support demanding factory and process-control systems that require robust environmental performance and many sensor/actuator interfaces.
  • High-density digital systems Large logic capacity and substantial on-chip memory enable designs that integrate multiple functions, custom algorithms, and complex state machines on a single FPGA.
  • Board-level integration and interface aggregation 840 I/Os and a 1932-FBGA package facilitate consolidation of multiple peripheral interfaces and high pin-count connectivity on compact PCBs.

Unique Advantages

  • Large logic fabric: 695,000 logic elements provide the headroom required for complex, multi-module FPGA implementations.
  • Significant embedded memory: Approximately 51.2 Mbits of on-chip RAM reduces dependence on external memory for many buffering and storage needs.
  • High I/O density: 840 I/O pins enable dense system integration and flexible interface routing options.
  • Industrial temperature support: −40 °C to 100 °C operating range suits deployments in harsher environments.
  • Compact, high-pin-count package: 1932-FBGA (45×45) surface-mount package balances board footprint with extensive connectivity.
  • RoHS compliance: Meets common environmental requirements for manufacturing and deployment.

Why Choose 5SGSED8N2F45I3G?

The 5SGSED8N2F45I3G delivers a balanced combination of logic capacity, embedded memory, and I/O density within the Stratix V family, making it suitable for designs that require substantial on-chip resources and robust industrial operation. Its specified core voltage range and 1932-FBGA package support system designs that demand a high level of integration and interface capability.

Designed and documented as part of the Stratix V device family by Intel/Altera, this device is a fit for engineering teams building scalable, high-density FPGA-based systems that require stable thermal performance and clear electrical characterization from vendor-provided datasheets.

Request a quote or submit an inquiry for the 5SGSED8N2F45I3G to evaluate availability and pricing for your next design.

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