5SGSED8N2F45I2CV

IC FPGA 840 I/O 1932FBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 840 51200000 695000 1932-BBGA, FCBGA

Quantity 1,535 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1932-FBGA, FC (45x45)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1932-BBGA, FCBGANumber of I/O840Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs262400Number of Logic Elements/Cells695000
Number of Gates840ECCNOBSOLETEHTS CodeN/A
QualificationN/ATotal RAM Bits51200000

Overview of 5SGSED8N2F45I2CV – Stratix® V GS FPGA, 695,000 logic elements, 840 I/Os

The 5SGSED8N2F45I2CV is an Intel Stratix® V GS field programmable gate array (FPGA) in a 1932-BBGA FCBGA package. It delivers high logic density and substantial on-chip memory in an industrial-grade FPGA targeted at designs requiring large programmable logic capacity and extensive I/O.

With 695,000 logic elements, approximately 51.2 Mbits of embedded memory, and 840 I/Os, this device supports complex, memory‑intensive logic implementations while operating over an industrial temperature range and a low-voltage core rail.

Key Features

  • Core & logic density – 695,000 logic elements to implement large, complex digital designs and custom processing pipelines.
  • Logic block count – Approximately 262,400 CLBs for fine-grained logic partitioning and resource allocation.
  • Embedded memory – Approximately 51.2 Mbits of on-chip RAM for buffering, packet processing, and local data storage.
  • I/O capability – 840 I/Os to support high-pin-count interfaces and dense board-level connectivity.
  • Power and core supply – Core voltage supply range from 870 mV to 930 mV to match system power architectures.
  • Package & mounting – 1932-BBGA (FCBGA), supplier package 1932-FBGA, FC (45×45); surface-mount mounting type for standard PCB assembly.
  • Industrial temperature grade – Rated for operation from –40 °C to 100 °C for deployment in industrial environments.
  • Environmental compliance – RoHS compliant.

Typical Applications

  • Industrial control and automation – Use the device’s industrial temperature rating, high logic density, and abundant I/Os to implement motor control, PLC functions, or machine-vision preprocessing in industrial systems.
  • High-density interface bridging – Large I/O count and substantial on-chip RAM make the FPGA suitable for bridging multiple parallel or serial interfaces and for protocol adaptation tasks.
  • Memory‑intensive custom logic – Approximately 51.2 Mbits of embedded memory supports buffering, data aggregation, and real-time packet or frame processing.
  • Complex algorithm acceleration – High logic element count enables hardware acceleration of compute-intensive algorithms, custom datapaths, and signal-processing blocks.

Unique Advantages

  • High programmable density: 695,000 logic elements provide the capacity to implement large-scale digital systems without external logic expansion.
  • Substantial on-chip RAM: Approximately 51.2 Mbits of embedded memory reduces reliance on external memory for many buffering and streaming tasks.
  • Extensive I/O support: 840 I/Os accommodate complex board-level designs with multiple high-pin-count interfaces.
  • Industrial readiness: –40 °C to 100 °C operating range and industrial grade classification support deployments in demanding environments.
  • Compact, assembly-ready package: 1932-BBGA FCBGA in a surface-mount form factor enables high routing density in compact PCB layouts.
  • Low-voltage core operation: 870–930 mV core supply range aligns with modern low-voltage system power domains.

Why Choose 5SGSED8N2F45I2CV?

The 5SGSED8N2F45I2CV positions itself for designs that require a combination of very high logic capacity, significant on-chip memory, and a large number of I/Os while meeting industrial temperature requirements. Its Stratix V GS architecture and package choices make it suitable for integrators building memory‑intensive, high‑I/O systems that must operate reliably across a wide temperature range.

For engineering teams focused on scalability and long-term deployment, this device offers the resource headroom and environmental margin to support complex custom logic, protocol handling, and hardware acceleration tasks within industrial applications.

Request a quote or submit an inquiry to obtain pricing, availability, and ordering information for the 5SGSED8N2F45I2CV.

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