5SGSED8N2F45I2CV
| Part Description |
Stratix® V GS Field Programmable Gate Array (FPGA) IC 840 51200000 695000 1932-BBGA, FCBGA |
|---|---|
| Quantity | 1,535 Available (as of May 6, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1932-FBGA, FC (45x45) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1932-BBGA, FCBGA | Number of I/O | 840 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 262400 | Number of Logic Elements/Cells | 695000 | ||
| Number of Gates | 840 | ECCN | OBSOLETE | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 51200000 |
Overview of 5SGSED8N2F45I2CV – Stratix® V GS FPGA, 695,000 logic elements, 840 I/Os
The 5SGSED8N2F45I2CV is an Intel Stratix® V GS field programmable gate array (FPGA) in a 1932-BBGA FCBGA package. It delivers high logic density and substantial on-chip memory in an industrial-grade FPGA targeted at designs requiring large programmable logic capacity and extensive I/O.
With 695,000 logic elements, approximately 51.2 Mbits of embedded memory, and 840 I/Os, this device supports complex, memory‑intensive logic implementations while operating over an industrial temperature range and a low-voltage core rail.
Key Features
- Core & logic density – 695,000 logic elements to implement large, complex digital designs and custom processing pipelines.
- Logic block count – Approximately 262,400 CLBs for fine-grained logic partitioning and resource allocation.
- Embedded memory – Approximately 51.2 Mbits of on-chip RAM for buffering, packet processing, and local data storage.
- I/O capability – 840 I/Os to support high-pin-count interfaces and dense board-level connectivity.
- Power and core supply – Core voltage supply range from 870 mV to 930 mV to match system power architectures.
- Package & mounting – 1932-BBGA (FCBGA), supplier package 1932-FBGA, FC (45×45); surface-mount mounting type for standard PCB assembly.
- Industrial temperature grade – Rated for operation from –40 °C to 100 °C for deployment in industrial environments.
- Environmental compliance – RoHS compliant.
Typical Applications
- Industrial control and automation – Use the device’s industrial temperature rating, high logic density, and abundant I/Os to implement motor control, PLC functions, or machine-vision preprocessing in industrial systems.
- High-density interface bridging – Large I/O count and substantial on-chip RAM make the FPGA suitable for bridging multiple parallel or serial interfaces and for protocol adaptation tasks.
- Memory‑intensive custom logic – Approximately 51.2 Mbits of embedded memory supports buffering, data aggregation, and real-time packet or frame processing.
- Complex algorithm acceleration – High logic element count enables hardware acceleration of compute-intensive algorithms, custom datapaths, and signal-processing blocks.
Unique Advantages
- High programmable density: 695,000 logic elements provide the capacity to implement large-scale digital systems without external logic expansion.
- Substantial on-chip RAM: Approximately 51.2 Mbits of embedded memory reduces reliance on external memory for many buffering and streaming tasks.
- Extensive I/O support: 840 I/Os accommodate complex board-level designs with multiple high-pin-count interfaces.
- Industrial readiness: –40 °C to 100 °C operating range and industrial grade classification support deployments in demanding environments.
- Compact, assembly-ready package: 1932-BBGA FCBGA in a surface-mount form factor enables high routing density in compact PCB layouts.
- Low-voltage core operation: 870–930 mV core supply range aligns with modern low-voltage system power domains.
Why Choose 5SGSED8N2F45I2CV?
The 5SGSED8N2F45I2CV positions itself for designs that require a combination of very high logic capacity, significant on-chip memory, and a large number of I/Os while meeting industrial temperature requirements. Its Stratix V GS architecture and package choices make it suitable for integrators building memory‑intensive, high‑I/O systems that must operate reliably across a wide temperature range.
For engineering teams focused on scalability and long-term deployment, this device offers the resource headroom and environmental margin to support complex custom logic, protocol handling, and hardware acceleration tasks within industrial applications.
Request a quote or submit an inquiry to obtain pricing, availability, and ordering information for the 5SGSED8N2F45I2CV.

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