5SGSED8N3F45C2G

The 5SGSED8N3F45C2G is a Stratix® V GS field-programmable gate array (FPGA) IC from Intel. It delivers very large logic capacity and substantial on-chip memory in a high-pin-count BGA package, aimed at commercial-grade systems requiring dense logic integration and extensive I/O.

With a core voltage supply range of 870 mV to 930 mV and an operating temperature range of 0 °C to 85 °C, this surface-mount device is specified for commercial applications where large logic and memory resources plus many I/O are required.

Key Features

• Core density  Approximately 695,000 logic elements for consolidating complex functionality into a single FPGA.
• Embedded memory  Approximately 51.2 Mbits of on-chip RAM to support buffering, state storage, and memory-intensive logic functions.
• I/O capability  840 general-purpose I/O pins to support dense board-level interfacing and multi-channel system connectivity.
• Power and voltage  Core supply voltage specified from 870 mV to 930 mV to guide precise power delivery and regulator selection.
• Package & mounting  1932-BBGA (FCBGA) package, supplier device package 1932-FBGA, FC (45×45); surface-mount mounting for compact board designs.
• Commercial grade operating range  Rated for commercial temperature operation from 0 °C to 85 °C.
• Environmental compliance  RoHS compliant.

Typical Applications

• High-density logic integration  Consolidate complex control and processing functions using the device's approximately 695,000 logic elements.
• I/O-heavy system interfaces  Implement multi-channel interfaces and dense board interconnects using up to 840 I/O pins.
• Memory-centric designs  Use approximately 51.2 Mbits of embedded memory for large buffers, FIFOs, or intermediate data storage without immediate external memory dependence.
• Commercial embedded systems  Deploy in commercial temperature environments that operate within 0 °C to 85 °C.

Unique Advantages

• Large logic capacity: Enables consolidation of multiple subsystems onto a single FPGA, reducing board-level complexity.
• Substantial on-chip memory: Approximately 51.2 Mbits of embedded RAM helps minimize external memory needs and simplifies memory architecture.
• High I/O count: 840 I/O pins reduce the need for external IO expanders and support rich peripheral connectivity.
• Compact high-pin-count package: The 1932-BBGA (FCBGA) surface-mount package supports dense implementations in constrained board space.
• Defined supply window: The specified 870 mV–930 mV core voltage range aids in selecting precise power delivery solutions for stable operation.
• RoHS compliant: Helps meet environmental regulatory requirements for commercial products.

Why Choose 5SGSED8N3F45C2G?

The 5SGSED8N3F45C2G positions itself as a high-capacity Stratix® V GS FPGA for commercial designs that demand extensive logic resources, significant embedded memory, and a large number of I/Os in a compact BGA package. Its specified core voltage range and commercial temperature rating make it suitable for production systems where these verified electrical and thermal conditions align with design requirements.

This device is well suited for engineers consolidating complex digital subsystems, implementing memory-heavy algorithms on-chip, or building I/O-rich platforms that benefit from a single, high-density FPGA solution backed by Intel's Stratix V device family documentation.

Request a quote or submit an inquiry to evaluate the 5SGSED8N3F45C2G for your next commercial FPGA design.