5SGSED8N3F45C2LN

IC FPGA 840 I/O 1932FBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 840 51200000 695000 1932-BBGA, FCBGA

Quantity 1,358 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1932-FBGA, FC (45x45)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1932-BBGA, FCBGANumber of I/O840Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs262400Number of Logic Elements/Cells695000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits51200000

Overview of 5SGSED8N3F45C2LN – Stratix® V GS Field Programmable Gate Array (FPGA) IC

The 5SGSED8N3F45C2LN is an Intel Stratix V GS FPGA in a 1932-BBGA FCBGA package, optimized for transceiver‑based, DSP‑centric applications. It combines a high logic capacity and substantial on‑chip memory with a family architecture designed for bandwidth‑intensive and high‑precision signal processing tasks.

Built on a 28‑nm process and targeted at commercial applications, this device offers large logic resources, extensive I/O, integrated DSP building blocks, and on‑chip memory to support demanding data and signal processing workloads.

Key Features

  • Logic Capacity – 695,000 logic elements suitable for complex custom logic, control, and data‑path implementations.
  • Embedded Memory – Approximately 51.2 Mbits of on‑chip RAM to support large buffers, FIFOs, and memory‑intensive algorithms.
  • DSP Resources (Stratix V GS) – GS devices in the Stratix V family provide abundant variable‑precision DSP blocks, supporting up to 3,926 18×18 or 1,963 27×27 multipliers for high‑precision arithmetic and filtering tasks.
  • Integrated Transceivers – Stratix V GS devices include integrated transceivers with 14.1‑Gbps data‑rate capability, addressing backplane and optical interface needs for high‑bandwidth links.
  • I/O and Package – 840 user I/Os in a 1932‑BBGA (FCBGA, 45×45) surface‑mount package to accommodate dense system connectivity and board integration.
  • Process and IP – 28‑nm TSMC process technology with Stratix V family architectural features such as redesigned adaptive logic modules, M20K embedded memory blocks, fractional PLLs, and Embedded HardCopy block support for hardened IP instantiation.
  • Power and Operating Range – Core supply range of 820 mV to 880 mV; commercial operating temperature 0 °C to 85 °C.
  • Compliance – RoHS compliant for environmental and manufacturing compatibility.

Typical Applications

  • High‑performance DSP systems – Leverage large DSP block counts and on‑chip memory for filtering, transformation, and real‑time signal processing.
  • Optical and Backplane Communications – Integrated 14.1‑Gbps transceivers support high‑bandwidth links used in optical transport and backplane interfaces.
  • Network and Packet Processing – High logic density and abundant I/O enable complex packet processing, traffic management, and protocol handling.
  • Broadcast and Military Communications – DSP‑centric architecture and transceiver integration suit demanding signal‑processing and link requirements in broadcast and communications equipment.
  • High‑performance Computing Acceleration – Large logic and memory resources support custom accelerators and data‑intensive compute kernels.

Unique Advantages

  • High logic and memory integration: 695,000 logic elements and approximately 51.2 Mbits of embedded RAM reduce external memory needs and simplify board design.
  • DSP‑focused architecture: Variable‑precision DSP blocks (up to 3,926 18×18 or 1,963 27×27 multipliers) enable efficient implementation of high‑precision mathematical pipelines.
  • Built‑in high‑speed I/O: 840 I/Os and integrated transceivers with 14.1‑Gbps capability streamline connectivity for high‑bandwidth systems.
  • Family‑level design advantages: Stratix V family features—including adaptive logic modules, M20K memories, fractional PLLs, and Embedded HardCopy block—support scalable design reuse and IP hardening strategies.
  • Commercial‑grade reliability: Specified operating temperature and RoHS compliance provide predictable performance for commercial deployments.

Why Choose 5SGSED8N3F45C2LN?

The 5SGSED8N3F45C2LN delivers a balance of high logic density, substantial embedded memory, and DSP/transceiver capabilities suited to bandwidth‑ and compute‑intensive commercial applications. Its Stratix V GS‑class architecture targets transceiver‑based, DSP‑centric designs where integrated multipliers and high‑speed links are essential.

This device is appropriate for design teams building complex communications, broadcast, network processing, or compute‑acceleration solutions who require a commercially graded FPGA with robust on‑chip resources and a family architecture that supports IP integration and production scalability.

Request a quote or submit an inquiry to receive pricing, availability, and ordering information for 5SGSED8N3F45C2LN.

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