5SGSED8N3F45C3G

The 5SGSED8N3F45C3G is a Stratix V GS field programmable gate array (FPGA) in a 1932‑BBGA FCBGA package. This commercial‑grade FPGA provides a high logic count and substantial on‑chip RAM to support complex, high‑density digital designs that require large I/O capacity and on‑die memory.

Designed for surface‑mount assembly, the device operates from a core supply range of 820 mV to 880 mV and across a commercial temperature range of 0 °C to 85 °C. The device is RoHS compliant.

Key Features

• Core Logic  Provides 695,000 logic elements for implementing large FPGA designs and complex state machines.
• Embedded Memory  Approximately 51.2 Mbits of on‑chip RAM to support buffering, large LUT structures, and memory‑intensive logic functions.
• I/O Capacity  840 device I/Os to accommodate wide parallel interfaces, extensive peripheral connectivity, and high‑pin‑count designs.
• Package & Mounting  1932‑BBGA (FCBGA) package, supplier package specified as 1932‑FBGA, FC (45×45); surface‑mount device suitable for board‑level integration.
• Power Supply  Core voltage supply range of 820 mV to 880 mV for device operation.
• Operating Temperature  Commercial grade operation from 0 °C to 85 °C.
• Regulatory  RoHS compliant.

Typical Applications

• High‑density digital logic designs  Implement large combinational and sequential logic functions using the device’s 695,000 logic elements and extensive on‑chip RAM.
• Wide I/O interface systems  Support boards and systems that require many parallel and serial interfaces with up to 840 I/Os.
• Memory‑intensive processing  Use the ~51.2 Mbits of embedded memory for buffering, packet queues, or local data storage in complex FPGA pipelines.

Unique Advantages

• High resource density: The combination of 695,000 logic elements and large embedded RAM enables consolidation of multi‑function designs into a single device.
• Large I/O count: 840 I/Os reduce the need for external I/O expanders and simplify board routing for high‑pin‑count systems.
• Compact package: 1932‑BBGA FCBGA package delivers high pin density in a compact footprint for space‑constrained board designs.
• Commercial temperature rating: Rated for 0 °C to 85 °C, suitable for standard commercial applications and environments.
• Regulatory compliance: RoHS compliance supports environmental and supply‑chain requirements for many product lines.

Why Choose 5SGSED8N3F45C3G?

The 5SGSED8N3F45C3G offers a high‑capacity Stratix V GS FPGA configuration that balances large logic resources, significant embedded memory, and an extensive I/O complement in a single commercial‑grade package. It is well suited for designs that require consolidation of complex digital functions and substantial on‑chip data storage while maintaining high pin density.

Engineers and procurement teams seeking a commercially rated Stratix V device with clear supply‑voltage and temperature specifications, a high logic count, and RoHS compliance will find this part appropriate for demanding, high‑capacity FPGA implementations.

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