5SGSED8N3F45C3N

The 5SGSED8N3F45C3N is an Intel Stratix V GS series FPGA built on a 28‑nm process. It combines high logic and memory capacity with integrated transceivers and variable‑precision DSP resources, targeting transceiver‑based, DSP‑centric and high‑bandwidth designs.

This device is optimized for bandwidth‑ and data‑intensive applications where large on‑chip memory, extensive I/O and high logic density are required. Its package and power characteristics support surface‑mount deployment in commercial‑grade systems.

Key Features

• Core & process  28‑nm TSMC process technology with Stratix V architecture elements including redesigned adaptive logic modules and comprehensive fabric clocking.
• Logic capacity  695,000 logic elements for high‑density logic integration.
• Embedded memory  Approximately 51.2 Mbits of on‑chip RAM implemented with M20K memory blocks.
• DSP resources  Variable‑precision DSP blocks common to the Stratix V family for high‑performance signal processing.
• High‑speed transceivers  GS‑variant integrated transceivers with 14.1‑Gbps data‑rate capability for backplane and optical interface applications.
• I/O and package  Up to 840 I/Os in a 1932‑BBGA (FCBGA) 1932‑FBGA, FC (45×45) supplier package; surface‑mount mounting type.
• Power and thermal  Core supply range 820 mV to 880 mV; commercial operating temperature 0 °C to 85 °C.
• Design integration  Embedded HardCopy block capability (family feature) supports hard IP instantiation such as PCIe Gen3/Gen2/Gen1.
• Compliance  RoHS‑compliant.

Typical Applications

• High‑performance digital signal processing  Use in DSP‑centric systems that leverage variable‑precision DSP blocks for intensive multiply/accumulate workloads.
• Optical and wireline communications  Backplane and optical interface designs that require integrated transceivers with multi‑Gbps data rates.
• Network packet processing and traffic management  Data‑intensive networking applications that benefit from large logic capacity and abundant I/O.
• Broadcast and high‑performance computing  Systems that require a mix of high logic density, on‑chip RAM and DSP resources for real‑time processing.

Unique Advantages

• High logic density: 695,000 logic elements enable complex, large‑scale designs in a single device.
• Substantial on‑chip memory: Approximately 51.2 Mbits of embedded RAM reduces external memory dependency and simplifies board design.
• Integrated high‑speed transceivers: 14.1‑Gbps capable transceivers (GS variant) support demanding backplane and optical interfaces.
• Robust DSP capability: Variable‑precision DSP blocks provide flexibility for a wide range of signal‑processing algorithms.
• Packaging and I/O scale: 840 I/Os in a 1932‑BBGA package support dense system integration and routing.
• Path to production: Family features include Embedded HardCopy blocks to support migration toward hardened ASIC implementations for higher‑volume production.

Why Choose 5SGSED8N3F45C3N?

The 5SGSED8N3F45C3N positions itself where high logic density, significant embedded memory, and integrated transceiver performance are required. As a Stratix V GS device, it addresses transceiver‑based and DSP‑centric application needs while supporting commercial temperature operation and surface‑mount assembly.

This device is suitable for engineering teams building high‑bandwidth communications, signal‑processing and data‑intensive systems that require a scalable FPGA platform and the option to leverage family hardening features for higher‑volume production.

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