5SGSED8N3F45I3G

The 5SGSED8N3F45I3G is a Stratix® V GS Field Programmable Gate Array (FPGA) in a 1932-BBGA FCBGA package. It provides a large logic fabric and on-chip memory suitable for complex, FPGA-based system designs.

Designed for industrial-grade deployments, the device combines 695,000 logic elements, approximately 51.2 Mbits of embedded RAM, and 840 user I/Os, enabling dense integration of logic, memory, and I/O in a single surface-mount package. The device operates over an industrial temperature range and a low core voltage window for targeted power domains.

Key Features

• Programmable Logic Capacity 695,000 logic elements (cells) for implementing large-scale digital logic and custom hardware accelerators.
• Embedded Memory Approximately 51.2 Mbits of on-chip RAM to support buffering, FIFOs, and embedded data storage without external memory for many functions.
• I/O Density 840 user I/Os to support dense external interfacing and multi-channel connectivity directly from the package.
• Package & Mounting 1932-BBGA, FCBGA (45×45) supplier device package in a surface-mount form factor for board-level assembly.
• Power Supply Core voltage supply range of 820 mV to 880 mV, enabling operation within a defined low-voltage core domain.
• Industrial Temperature Grade Rated for operation from –40 °C to 100 °C to meet industrial-environment requirements.
• Regulatory Status RoHS compliant.

Typical Applications

• Industrial Control Systems Industrial temperature rating and high I/O count make the device suitable for complex control and automation interfaces.
• High‑Density Logic Integration Large logic element count and substantial embedded RAM allow consolidation of multiple logic functions and accelerators onto a single FPGA.
• High‑I/O Embedded Systems Up to 840 I/Os support multi-channel sensor, actuator, or peripheral connections in embedded designs.

Unique Advantages

• Extensive Logic Resources: 695,000 logic elements provide the raw capacity to implement large, complex logic designs without partitioning across multiple devices.
• Substantial On‑Chip Memory: Approximately 51.2 Mbits of embedded RAM reduces dependence on external memory for many buffering and data-path requirements.
• High I/O Count: 840 user I/Os enable broad connectivity and reduce the need for external I/O expanders.
• Industrial‑Grade Operation: –40 °C to 100 °C operating range supports deployment in demanding environmental conditions.
• Compact Surface‑Mount Package: 1932-BBGA FCBGA packaging provides a high-pin-count solution in a manufacturable surface-mount format.
• Controlled Core Voltage: Defined 820–880 mV supply window allows predictable power planning for the core domain.

Why Choose 5SGSED8N3F45I3G?

The 5SGSED8N3F45I3G positions itself as a high-capacity Stratix V GS FPGA option for industrial designs that require large logic density, extensive on-chip memory, and a high number of I/Os in a surface-mount FCBGA package. Its industrial temperature rating and defined core supply range support robust system integration and reliable operation in demanding environments.

This device is appropriate for engineering teams and procurement seeking a single-device solution to consolidate complex logic, memory buffering, and dense I/O needs while maintaining manufacturable packaging and compliance with RoHS requirements.

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