5SGSED8N3F45I3LG

IC FPGA 840 I/O 1932FBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 840 51200000 695000 1932-BBGA, FCBGA

Quantity 1,347 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1932-FBGA, FC (45x45)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1932-BBGA, FCBGANumber of I/O840Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs262400Number of Logic Elements/Cells695000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits51200000

Overview of 5SGSED8N3F45I3LG – Stratix® V GS FPGA, 695,000 logic elements, 1932-BBGA

The 5SGSED8N3F45I3LG is a Stratix® V GS Field Programmable Gate Array (FPGA) in a high-pin-count FCBGA package designed for industrial-grade systems. It delivers a large programmable fabric, extensive I/O, and significant on-chip memory for dense, compute- and I/O-intensive designs.

Targeted at applications that require high logic capacity, broad I/O, and industrial temperature operation, this device balances integration and scalability with a low-voltage core supply and surface-mount packaging suitable for volume assembly.

Key Features

  • Logic Capacity — 695,000 logic elements to implement complex digital functions and sizeable custom logic blocks.
  • Embedded Memory — Approximately 51.2 Mbits of on-chip RAM for buffer, queueing, and local data storage requirements.
  • I/O Density — 840 user I/O pins to support high-channel-count interfaces and board-level connectivity.
  • Power and Core Voltage — Core supply range 820 mV to 880 mV to match low-voltage system domains.
  • Package & Mounting — 1932-BBGA FCBGA (supplier package: 1932-FBGA, FC, 45×45) in a surface-mount form factor for compact, high-pin-count designs.
  • Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C for deployment in temperature-challenging environments.
  • Regulatory — RoHS compliant for material and process compliance.

Typical Applications

  • High-density networking and switching — Use the large logic fabric and abundant I/O to implement packet processing, packet classification, and custom switching logic.
  • Industrial control and automation — Industrial temperature rating and high I/O count enable motor control, multi-axis coordination, and deterministic I/O interfaces.
  • Data acceleration and compute offload — Substantial logic and embedded memory enable hardware-accelerated data-paths and custom compute kernels.
  • Broadcast and video processing — High logic capacity and on-chip RAM support real-time video pipelines, format conversion, and buffering tasks.

Unique Advantages

  • Large programmable fabric: 695,000 logic elements provide capacity for complex, high-parallelism designs without external logic expansion.
  • Substantial on-chip memory: Approximately 51.2 Mbits of embedded RAM reduces dependence on external memory for many buffering and state-storage needs.
  • Extensive I/O: 840 I/O pins allow direct interfacing to a wide range of peripherals, channels, and high-density board layouts.
  • Industrial temperature operation: Rated −40 °C to 100 °C for use in harsh or outdoor industrial deployments.
  • High-pin-count FCBGA package: 1932-ball FCBGA (45×45) enables high signal density in a compact footprint suitable for surface-mount assembly.
  • Low-voltage core compatibility: 820–880 mV supply range aligns with modern low-voltage power architectures used in dense FPGA systems.

Why Choose 5SGSED8N3F45I3LG?

This Stratix V GS FPGA is positioned for designers who need a high-capacity, industrial-grade programmable device with extensive I/O and substantial on-chip memory. Its combination of 695,000 logic elements, approximately 51.2 Mbits of embedded RAM, and 840 I/O pins makes it suitable for demanding signal processing, networking, and industrial control applications where integration and thermal robustness matter.

Choosing this device offers scalability within FPGA-based designs and reduces board-level complexity by consolidating logic, memory, and I/O. The package and voltage characteristics support modern assembly and power domains while RoHS compliance supports regulatory requirements.

Request a quote or submit an inquiry to obtain pricing, availability, and ordering information for the 5SGSED8N3F45I3LG.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up