5SGSED8N3F45I3LG
| Part Description |
Stratix® V GS Field Programmable Gate Array (FPGA) IC 840 51200000 695000 1932-BBGA, FCBGA |
|---|---|
| Quantity | 1,347 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1932-FBGA, FC (45x45) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1932-BBGA, FCBGA | Number of I/O | 840 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 262400 | Number of Logic Elements/Cells | 695000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 51200000 |
Overview of 5SGSED8N3F45I3LG – Stratix® V GS FPGA, 695,000 logic elements, 1932-BBGA
The 5SGSED8N3F45I3LG is a Stratix® V GS Field Programmable Gate Array (FPGA) in a high-pin-count FCBGA package designed for industrial-grade systems. It delivers a large programmable fabric, extensive I/O, and significant on-chip memory for dense, compute- and I/O-intensive designs.
Targeted at applications that require high logic capacity, broad I/O, and industrial temperature operation, this device balances integration and scalability with a low-voltage core supply and surface-mount packaging suitable for volume assembly.
Key Features
- Logic Capacity — 695,000 logic elements to implement complex digital functions and sizeable custom logic blocks.
- Embedded Memory — Approximately 51.2 Mbits of on-chip RAM for buffer, queueing, and local data storage requirements.
- I/O Density — 840 user I/O pins to support high-channel-count interfaces and board-level connectivity.
- Power and Core Voltage — Core supply range 820 mV to 880 mV to match low-voltage system domains.
- Package & Mounting — 1932-BBGA FCBGA (supplier package: 1932-FBGA, FC, 45×45) in a surface-mount form factor for compact, high-pin-count designs.
- Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C for deployment in temperature-challenging environments.
- Regulatory — RoHS compliant for material and process compliance.
Typical Applications
- High-density networking and switching — Use the large logic fabric and abundant I/O to implement packet processing, packet classification, and custom switching logic.
- Industrial control and automation — Industrial temperature rating and high I/O count enable motor control, multi-axis coordination, and deterministic I/O interfaces.
- Data acceleration and compute offload — Substantial logic and embedded memory enable hardware-accelerated data-paths and custom compute kernels.
- Broadcast and video processing — High logic capacity and on-chip RAM support real-time video pipelines, format conversion, and buffering tasks.
Unique Advantages
- Large programmable fabric: 695,000 logic elements provide capacity for complex, high-parallelism designs without external logic expansion.
- Substantial on-chip memory: Approximately 51.2 Mbits of embedded RAM reduces dependence on external memory for many buffering and state-storage needs.
- Extensive I/O: 840 I/O pins allow direct interfacing to a wide range of peripherals, channels, and high-density board layouts.
- Industrial temperature operation: Rated −40 °C to 100 °C for use in harsh or outdoor industrial deployments.
- High-pin-count FCBGA package: 1932-ball FCBGA (45×45) enables high signal density in a compact footprint suitable for surface-mount assembly.
- Low-voltage core compatibility: 820–880 mV supply range aligns with modern low-voltage power architectures used in dense FPGA systems.
Why Choose 5SGSED8N3F45I3LG?
This Stratix V GS FPGA is positioned for designers who need a high-capacity, industrial-grade programmable device with extensive I/O and substantial on-chip memory. Its combination of 695,000 logic elements, approximately 51.2 Mbits of embedded RAM, and 840 I/O pins makes it suitable for demanding signal processing, networking, and industrial control applications where integration and thermal robustness matter.
Choosing this device offers scalability within FPGA-based designs and reduces board-level complexity by consolidating logic, memory, and I/O. The package and voltage characteristics support modern assembly and power domains while RoHS compliance supports regulatory requirements.
Request a quote or submit an inquiry to obtain pricing, availability, and ordering information for the 5SGSED8N3F45I3LG.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018