5SGSED8N3F45I3N

The 5SGSED8N3F45I3N is a Stratix® V GS field programmable gate array (FPGA) from Intel, offered in an industrial temperature grade. This device delivers a high-density programmable fabric with 695,000 logic elements and approximately 51.2 Mbits of embedded memory, packaged in a 1932-ball FCBGA (45 × 45 mm) for surface-mount assembly.

With 840 user I/Os, a core supply range of 820 mV to 880 mV, and an operating temperature range of −40 °C to 100 °C, the device is suitable for industrial-grade systems that require large logic capacity, significant on-chip memory, and high I/O density.

Key Features

• High Logic Capacity — 695,000 logic elements to implement large-scale digital designs and complex custom logic.
• Configurable Logic Blocks — Device includes 262,400 CLBs for structured logic mapping and resource allocation.
• On-Chip Memory — Approximately 51.2 Mbits of embedded memory to support large buffers, FIFOs, and state storage without external RAM.
• Extensive I/O — 840 user I/Os to support wide parallel interfaces, multi-channel connectivity, and dense board-level integration.
• Package and Mounting — 1932-BBGA (FCBGA) supplier package (1932-FBGA, FC 45×45) designed for surface-mount assembly in compact, high-pin-count systems.
• Power — Core supply voltage range of 820 mV to 880 mV enabling operation within tightly controlled low-voltage cores.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C for use in temperature-challenging environments.
• RoHS Compliant — Meets RoHS environmental requirements for lead-free assembly.

Typical Applications

• High‑speed communications and transceiver systems — Large logic and memory resources combined with family transceiver capabilities support designs requiring high-bandwidth serial connectivity.
• Industrial control and automation — Industrial temperature rating (−40 °C to 100 °C) and robust I/O count make the device suitable for factory, process, and machine-control applications.
• High‑density I/O systems — 840 I/Os allow consolidation of multiple interfaces and peripherals on a single FPGA for complex system integration.

Unique Advantages

• Large programmable fabric: 695,000 logic elements enable implementation of complex algorithms and multi-function systems on a single device.
• Significant on-chip memory: Approximately 51.2 Mbits of embedded RAM reduces dependence on external memory, lowering BOM and improving latency for buffer-intensive designs.
• High I/O count: 840 user I/Os simplify board routing and permit direct interfacing with multiple peripherals and high-pin-count connectors.
• Industrial-rated operation: −40 °C to 100 °C temperature range supports deployment in harsh or temperature-variable environments.
• Compact, high‑density package: 1932-ball FCBGA (45×45 mm) facilitates high-pin-count implementations while minimizing PCB area.
• RoHS compliant: Facilitates lead-free assembly and regulatory alignment for many global markets.

Why Choose 5SGSED8N3F45I3N?

The 5SGSED8N3F45I3N combines a very large programmable logic capacity with substantial embedded memory and a very high I/O count in a compact FCBGA package, making it well suited to industrial designs that demand integration, density, and thermal robustness. Its defined core voltage range and industrial temperature grade provide concrete, verifiable parameters for system power and thermal design.

This device is a fit for engineering teams building complex FPGA-based systems requiring on-chip memory, heavy I/O connectivity, and the ability to operate across an extended temperature range, backed by Intel’s Stratix V family documentation and device specifications.

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