5SGSED8N3F46I3N

IC FPGA STRATIX V GS FLIP CHIP
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 52428800 695000

Quantity 707 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device PackageN/AGradeIndustrialOperating Temperature-40°C – 100°C
Package / CaseN/ANumber of I/O840Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs262400Number of Logic Elements/Cells695000
Number of GatesN/AECCNOBSOLETEHTS CodeN/A
QualificationN/ATotal RAM Bits52428800

Overview of 5SGSED8N3F46I3N – Stratix® V GS Field Programmable Gate Array (FPGA)

The 5SGSED8N3F46I3N is a Stratix V GS Field Programmable Gate Array (FPGA) IC designed for high-density programmable-logic applications. It combines a large logic fabric and substantial on-chip memory with a high I/O count and industrial-grade operating range to support complex digital designs.

Targeted at applications that require extensive logic resources, significant embedded memory, and robust operating conditions, this device delivers a balance of integration and reliability where programmable hardware acceleration and extensive interfacing are required.

Key Features

  • Logic Capacity  Provides 695,000 logic elements for implementing large-scale digital designs and complex compute kernels.
  • Embedded Memory  Includes approximately 52.4 Mbits of on-chip RAM to support buffering, look-up tables, and memory-intensive algorithms without external RAM.
  • I/O Resources  Offers 840 I/O pins to accommodate extensive peripheral, sensor, and high-throughput interface connectivity.
  • Power Supply  Operates with a supply range of 820 mV to 880 mV, enabling integration into low-voltage core power domains.
  • Industrial Temperature Range  Rated for operation from −40 °C to 100 °C, suitable for industrial environments and extended-temperature deployments.
  • Mounting  Surface-mount package for standard PCB assembly processes.
  • Regulatory  RoHS compliant to meet environmental and manufacturing requirements.

Typical Applications

  • High-density digital acceleration  Implement parallel processing blocks, custom accelerators, and data-path engines that require extensive logic and on-chip RAM.
  • Telecommunications and networking  Use the device where large logic fabrics and many I/Os are needed to implement packet processing, protocol offload, or interface bridging.
  • Industrial control and automation  Deploy in systems needing robust temperature tolerance and high I/O counts for sensor aggregation, motor control, and real-time control logic.
  • System prototyping and integration  Leverage the large logic and memory resources to prototype complex SoC functions and consolidate multiple discrete functions into a single FPGA-based design.

Unique Advantages

  • Substantial logic resources: 695,000 logic elements enable integration of large IP blocks and complex state machines within one device, reducing board-level component count.
  • Significant on-chip memory: Approximately 52.4 Mbits of embedded RAM reduces dependency on external memory for buffering and local storage, improving latency and system throughput.
  • High I/O density: 840 I/Os simplify interfacing multiple peripherals and high-speed links without extensive multiplexing or external serializers.
  • Industrial-grade operation: Rated from −40 °C to 100 °C to meet demanding environmental requirements in industrial deployments.
  • Low-voltage core operation: Core supply range of 820 mV to 880 mV supports modern low-voltage power architectures.
  • Regulatory compliance: RoHS compliance helps meet environmental and supply-chain requirements.

Why Choose 5SGSED8N3F46I3N?

The 5SGSED8N3F46I3N positions itself as a high-capacity Stratix V GS FPGA option for designs that demand large programmable logic, sizable embedded memory, and extensive I/O connectivity within an industrial temperature envelope. Its combination of 695,000 logic elements, approximately 52.4 Mbits of on-chip RAM, and 840 I/Os provides a platform for consolidating complex system functions onto a single programmable device.

For engineering teams developing advanced digital systems—where integration, deterministic on-chip resources, and robust operating conditions matter—this FPGA offers the scalability and resource profile to accelerate development and simplify system architecture while maintaining compliance with RoHS requirements.

Request a quote or submit an inquiry to obtain pricing and availability for the 5SGSED8N3F46I3N and to discuss how it fits your next high-density FPGA design.

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