5SGSMD3E1H29C1G

The 5SGSMD3E1H29C1G is a Stratix® V GS Field Programmable Gate Array (FPGA) in a 780-ball BGA (FCBGA) package designed for commercial applications. It provides a high logic density and substantial on-chip memory for designs that require extensive programmable logic, embedded RAM, and a large I/O count.

With 236,000 logic element cells, approximately 13.3 Mbits of embedded memory and 360 I/O pins, this device targets complex digital designs where integration, I/O capacity, and low-voltage core operation are key considerations.

Key Features

• Core Logic 236,000 logic element cells to implement complex combinational and sequential logic at high density.
• Embedded Memory Approximately 13.3 Mbits of on-chip RAM to support large buffering, state storage, and data-path requirements.
• I/O Capacity 360 configurable I/O pins for broad system connectivity and flexible interface routing.
• Package Options 780-ball BGA (FCBGA) package; supplier device package listed as 780-HBGA (33×33) for compact, high-density board integration.
• Low-Voltage Core Core supply range specified at 870 mV to 930 mV to support targeted system power architectures.
• Commercial Temperature Grade Rated for commercial operation from 0 °C to 85 °C.
• Standards Compliance RoHS compliant for environmental and manufacturing compatibility.

Typical Applications

• High-density digital logic — Implement complex, large-scale programmable logic functions that require hundreds of thousands of logic elements and significant embedded RAM.
• System prototyping and integration — Consolidate multiple functions into a single FPGA with large I/O capacity for rapid development and system-level validation.
• Custom compute and data-path acceleration — Use the device’s large logic and memory resources to create application-specific acceleration and data buffering solutions.

Unique Advantages

• High logic density: 236,000 logic element cells provide the headroom to implement large, complex designs without immediate partitioning across devices.
• Significant embedded memory: Approximately 13.3 Mbits of on-chip RAM reduces reliance on external memory for many buffering and storage needs, simplifying board design.
• Generous I/O count: 360 I/Os enable extensive peripheral and interface connectivity from a single package.
• Compact package footprint: 780-ball FCBGA (780-HBGA, 33×33) offers a space-efficient solution for high-pin-count FPGA integration.
• Low-voltage core operation: 0.87–0.93 V supply range aligns with modern power-optimized system architectures.
• Commercial-grade reliability: Specified 0 °C to 85 °C operating range for standard commercial deployments.

Why Choose 5SGSMD3E1H29C1G?

The 5SGSMD3E1H29C1G delivers a balanced combination of high logic capacity, substantial embedded RAM, and broad I/O in a compact 780-ball BGA package. It is suited to engineers and system designers who need to integrate complex programmable logic and memory-intensive functions while maintaining a streamlined board footprint and low-voltage core operation.

Choose this Stratix® V GS device when your design calls for high integration, ample on-chip memory, and extensive connectivity within a commercial temperature-grade FPGA platform backed by documented electrical and switching characteristics for the Stratix V family.

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