5SGSMD3E1H29C1WN

The 5SGSMD3E1H29C1WN is an Intel Stratix® V GS field programmable gate array (FPGA) in a 780-ball BGA (FCBGA) package. It delivers high logic density and significant on-chip RAM capacity in a surface-mount package targeted for commercial-grade applications.

With 236,000 logic elements, approximately 13.3 Mbits of embedded RAM, and 360 user I/O, this device is designed for complex programmable logic implementations where dense logic, memory, and I/O capacity are required.

Key Features

• Core Capacity – 236,000 logic elements to implement large-scale digital designs and complex custom logic functions.
• Embedded Memory – Approximately 13.3 Mbits of on-chip RAM to support buffering, FIFOs, and memory-intensive logic without external memory in many use cases.
• I/O Resources – 360 user I/O pins for broad peripheral and subsystem interfacing in high-pin-count designs.
• Power and Core Voltage – Specified operating core voltage range from 870 mV to 930 mV for the device core.
• Package and Mounting – 780-BBGA (FCBGA) package; supplier device package listed as 780-HBGA (33×33). Surface-mount mounting type for PCB assembly.
• Temperature and Grade – Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Compliance – RoHS compliant, supporting regulatory-driven manufacturing and assembly flows.

Typical Applications

• High-density programmable logic – Implement large-scale custom logic and control functions using the device’s 236,000 logic elements and abundant on-chip RAM.
• I/O-rich embedded systems – Leverage 360 I/O pins for interfacing multiple subsystems, sensors, and peripherals in commercial designs.
• System integration and prototyping – Surface-mount 780-BBGA packaging and substantial resource counts make the device suitable for compact system boards and advanced prototypes.

Unique Advantages

• Large logic capacity: 236,000 logic elements enable complex datapaths and wide parallelism without external programmable logic.
• Significant on-chip RAM: Approximately 13.3 Mbits of embedded memory reduces dependence on external memory for many buffering and storage needs.
• Extensive I/O: 360 user I/O pins provide flexibility for multi-interface designs and dense board-level connectivity.
• Compact FCBGA package: 780-BBGA (33×33) FCBGA footprint balances pin count with board-area efficiency for surface-mount assembly.
• Commercial operating range: Specified 0 °C to 85 °C rating aligns with standard commercial electronics deployment.
• Regulatory readiness: RoHS compliance supports environmentally driven manufacturing requirements.

Why Choose 5SGSMD3E1H29C1WN?

The 5SGSMD3E1H29C1WN combines high logic density, substantial embedded RAM, and a large complement of user I/O in a commercial-grade Stratix V GS FPGA package. This combination positions the device for demanding commercial applications that require integrated logic, memory, and I/O resources in a surface-mount form factor.

Engineers designing complex FPGA-based systems will find the device’s resource balance useful for consolidating functions on a single chip, simplifying board-level design and enabling scalable implementations within Intel’s Stratix V device family documentation and support ecosystem.

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