5SGSMD3E1H29C2G

The 5SGSMD3E1H29C2G is a Stratix V GS family FPGA from Intel, delivered in a 780-BBGA FCBGA package. It combines high logic density with substantial on-chip RAM and a large I/O count for complex digital designs operating in commercial temperature environments.

With 236,000 logic elements, approximately 13.3 Mbits of embedded memory and 360 I/Os, this device is engineered for designs that require extensive programmable logic, local memory buffering, and versatile I/O connectivity while operating at a core supply of 870 mV–930 mV.

Key Features

• Logic Capacity 236,000 logic elements provide high-density programmable logic for complex state machines, custom datapaths, and wide parallel processing implementations.
• Embedded Memory Approximately 13.3 Mbits of on-chip RAM support deep buffering, on-chip caches, and local memory for DSP and packet processing tasks.
• I/O Resources 360 I/O pins enable broad external interfacing for multi-channel sensor, control, or high-pin-count peripheral connections.
• Power Core Supply Core voltage specified at 870 mV to 930 mV to match system power rails and maintain specified operating conditions.
• Package & Mounting Supplied in a 780-BBGA (FCBGA) package—supplier device package 780-HBGA (33×33)—designed for surface-mount assembly in compact, high-density boards.
• Commercial Temperature Grade Rated for 0 °C to 85 °C operation for standard commercial-environment deployments.
• Documented Electrical & Switching Characteristics The Stratix V device datasheet documents electrical and switching characteristics, including I/O timing and programmable I/O element and output buffer delays for system-level timing planning.
• RoHS Compliant Meets RoHS requirements for environmental compliance.

Typical Applications

• High-density digital processing — Implement large custom datapaths, parallel compute kernels, and complex state machines where substantial logic and on-chip RAM are required.
• Network and protocol bridging — Use the device’s abundant I/O and embedded memory for packet buffering, format conversion, and interface adaptation.
• Prototyping and system integration — Leverage the high logic element count and commercial-grade package for prototyping advanced IP and validating system architectures.
• Signal processing and buffering — Deploy on-chip RAM for local buffering and intermediate storage in DSP and streaming-data pipelines.

Unique Advantages

• High logic density: 236,000 logic elements enable integration of large digital functions into a single FPGA, reducing board-level part count.
• Substantial embedded memory: Approximately 13.3 Mbits of on-chip RAM supports deep buffering and local data storage to improve throughput and reduce external memory dependency.
• Extensive I/O connectivity: 360 I/Os provide flexibility for multi-channel interfaces and high-pin-count peripherals without intermediate multiplexing logic.
• Compact BGA footprint: 780-BBGA (33×33) package allows dense PCB integration while supporting surface-mount assembly processes.
• Commercial-grade thermal range: Rated 0 °C to 85 °C for reliable operation in standard commercial environments.
• Comprehensive device documentation: Stratix V datasheet coverage of electrical and switching characteristics supports system-level timing and power planning.

Why Choose 5SGSMD3E1H29C2G?

This Stratix V GS FPGA balances high programmable logic capacity, significant embedded memory, and a large I/O complement in a surface-mount 780-BBGA package suitable for commercial applications. It is well suited to engineers and system designers who need to consolidate complex digital functions, implement substantial buffering on-chip, and maintain a compact PCB footprint.

Backed by Stratix V family documentation for electrical and switching characteristics, the 5SGSMD3E1H29C2G provides the specification-level detail needed for integration into demanding designs where logic density, memory, and I/O scalability are primary selection criteria.

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