5SGSMD3E1H29C2N

IC FPGA 360 I/O 780HBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 360 13312000 236000 780-BBGA, FCBGA

Quantity 991 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package780-HBGA (33x33)GradeCommercialOperating Temperature0°C – 85°C
Package / Case780-BBGA, FCBGANumber of I/O360Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs89000Number of Logic Elements/Cells236000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits13312000

Overview of 5SGSMD3E1H29C2N – Stratix® V GS FPGA, 236,000 logic elements, 360 I/Os, 780-BBGA

The 5SGSMD3E1H29C2N is a Stratix V GS field-programmable gate array (FPGA) optimized for DSP-centric, transceiver-enabled designs. Built on a 28‑nm process, this device combines a high logic capacity with abundant DSP resources and on-chip memory to address bandwidth- and compute-intensive applications.

Designed for commercial-temperature systems, the device integrates a dense fabric, multi-track routing and a comprehensive clocking network to support complex signal-processing, networking and communications tasks while providing a migration path to hardened ASIC implementations.

Key Features

  • Core & architecture  28‑nm process technology with a redesigned adaptive logic module (ALM) and an advanced fabric clocking network for scalable logic implementation.
  • Logic capacity  236,000 logic elements to implement large-scale programmable logic and control functions.
  • Variable-precision DSP blocks  Abundant DSP resources supporting up to 3,926 18×18 or 1,963 27×27 multipliers for high-performance digital signal processing.
  • On-chip memory  Approximately 13.3 Mbits of embedded memory organized in 20 Kbit (M20K) blocks for buffering, look-up tables and state storage.
  • Integrated transceivers & I/O  GS variant transceivers with 14.1‑Gbps data-rate capability and 360 I/O pins to support high-speed serial and parallel interfaces.
  • Power  Core supply documented in the product data at 870 mV to 930 mV (device family core voltage options include 0.85 V or 0.9 V).
  • Packaging & mounting  Surface-mount 780‑BBGA FCBGA package (supplier package: 780‑HBGA, 33×33) suitable for high-density board designs.
  • Operational range & compliance  Commercial grade operation from 0 °C to 85 °C and RoHS compliant.
  • Embedded Hard IP  Includes an Embedded HardCopy Block used to harden IP instantiations (for example, PCIe Gen3/Gen2/Gen1), enabling a low-risk path from FPGA prototype to HardCopy ASIC.

Typical Applications

  • High-performance DSP systems  On-chip DSP blocks and large logic capacity enable complex signal processing for applications such as broadcast, radar and compute-accelerator tasks.
  • Optical and packet transport  Integrated transceivers and high memory bandwidth support 40G/100G transport, backplane and optical interface implementations.
  • Network and communications equipment  Combines plentiful logic, memory and I/O for packet processing, traffic management and protocol offload in wireline and telecommunications gear.
  • System prototyping and ASIC migration  Use as a prototyping platform with a documented migration path to HardCopy V ASICs for volume production.

Unique Advantages

  • High DSP density: Supports thousands of multipliers (up to 3,926 18×18 or 1,963 27×27), enabling efficient implementation of multiply‑accumulate and filter algorithms.
  • Large programmable fabric: 236,000 logic elements provide the capacity to integrate control, protocol, and dataflow logic on a single device.
  • Substantial on-chip memory: Approximately 13.3 Mbits of embedded memory (M20K blocks) for buffering, packet queuing and state retention without external RAM.
  • Transceiver integration: GS transceivers rated at 14.1 Gbps and 360 I/Os reduce external SERDES requirements for high-speed link implementations.
  • Commercial-grade thermal profile: Rated for 0 °C to 85 °C operation and supplied in a high-density 780‑BBGA package for compact system designs.
  • Path to hardened ASICs: Embedded HardCopy Block and documented HardCopy V migration options enable a predictable route from prototype to production ASIC.

Why Choose 5SGSMD3E1H29C2N?

The 5SGSMD3E1H29C2N positions itself as a high-capacity, DSP‑oriented Stratix V GS FPGA for commercial applications that demand substantial logic, memory and transceiver bandwidth in a single device. Its combination of 236,000 logic elements, extensive DSP multipliers and approximately 13.3 Mbits of embedded memory makes it suitable for data‑intensive signal processing and networking designs.

Backed by the Stratix V device architecture—multi-track routing, M20K memory blocks, fractional PLLs and an Embedded HardCopy Block—this FPGA supports complex system integration and provides a documented path to ASIC hardening for teams planning volume production or long-term product roadmaps.

Request a quote or submit a sales inquiry to start your evaluation of the 5SGSMD3E1H29C2N for your next high-performance FPGA design.

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