5SGSMD3E1H29I2WN

The 5SGSMD3E1H29I2WN is a Stratix® V GS Field Programmable Gate Array (FPGA) IC from Intel. It delivers high programmable logic capacity and substantial on‑chip memory in a high‑pin‑count FCBGA package for demanding embedded and industrial applications.

With 236,000 logic elements, approximately 13.3 Mbits of embedded memory, and 360 user I/Os, this device is tailored for designs that require large logic fabrics, significant on‑chip RAM, and broad I/O integration while operating across an industrial temperature range.

Key Features

• Logic Capacity — 236,000 logic elements provide a large programmable fabric for complex logic, datapath and control implementations.
• Embedded Memory — Approximately 13.3 Mbits of on‑chip RAM to support buffering, caching, and state storage without external memory for many use cases.
• I/O Resources — 360 available I/Os enable rich board‑level connectivity and multiple parallel interfaces.
• Power/Core Supply — Core supply range specified at 870 mV to 930 mV for regulated system integration.
• Package & Mounting — 780‑BBGA (FCBGA) package; supplier device package listed as 780‑HBGA (33×33); surface‑mount construction suitable for modern PCB assembly.
• Temperature & Grade — Industrial grade device with an operating temperature range of −40°C to 100°C for reliable performance in harsh environments.
• Regulatory — RoHS compliant.
• Documented Electrical Characteristics — Electrical and switching characteristics for Stratix V devices are documented in the Stratix V Device Datasheet.

Unique Advantages

• High integration density: 236,000 logic elements reduce the need for multiple FPGAs or external glue logic in complex systems.
• Significant on‑chip RAM: Approximately 13.3 Mbits of embedded memory supports large buffers and local data storage, simplifying memory hierarchies.
• Extensive I/O count: 360 I/Os enable flexible interfacing to peripherals, sensors, and external ICs without immediate reliance on external expanders.
• Designed for industrial environments: Rated for −40°C to 100°C operation, supporting deployments that require wide temperature tolerance.
• High‑pin‑count FCBGA package: 780‑BBGA (33×33) package allows dense routing and high‑bandwidth board layouts in compact footprints.
• RoHS compliance: Conforms to lead‑free manufacturing and environmental requirements.

Why Choose 5SGSMD3E1H29I2WN?

The 5SGSMD3E1H29I2WN positions itself as a high‑capacity Stratix V GS FPGA option for developers who need a large logic array, ample embedded RAM, and broad I/O in a single, industrial‑rated package. Its combination of logic density, on‑chip memory, and 360 I/Os supports consolidation of functions and simpler board designs.

Backed by the Stratix V device documentation, this FPGA is suited for teams building advanced embedded systems that demand scalable programmable resources, robust thermal performance, and compliance with RoHS requirements.

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