5SGSMD3E1H29I2G

The 5SGSMD3E1H29I2G is a Stratix® V GS field-programmable gate array (FPGA) IC from Intel, supplied in a 780-BBGA FCBGA package (780-HBGA, 33×33). It delivers a high-density programmable fabric with a large embedded RAM capacity and extensive I/O resources for industrial applications.

With 236,000 logic elements, approximately 13.3 Mbits of on-chip RAM and 360 user I/Os, this device targets designs that require substantial custom logic integration, high channel density and industrial temperature operation.

Key Features

• Core Capacity  236,000 logic elements provide a large programmable fabric for complex custom logic, state machines and accelerator functions.
• Logic Blocks  Approximately 89,000 logic blocks reflecting the device’s internal block organization for mapped logic resources.
• Embedded Memory  Approximately 13.3 Mbits of embedded RAM to support on-chip buffering, lookup tables and data storage for high-throughput designs.
• I/O Density  360 general-purpose I/Os to accommodate wide parallel interfaces, multi-lane connectivity and dense board-level integration.
• Power and Voltage  Core supply range specified at 870 mV to 930 mV for the device core voltage domain.
• Package & Mounting  780-BBGA FCBGA package (supplier device package: 780-HBGA, 33×33) with surface-mount mounting for compact board-level integration.
• Operating Range & Grade  Industrial-grade device rated for operation from −40°C to 100°C, suitable for temperature-demanding environments.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Industrial Control & Automation  Industrial-grade temperature rating and high I/O count enable robust sensor/actuator interfacing and real-time control logic.
• Communications & Networking  Large logic capacity and extensive I/O resources support protocol processing, packet handling and custom interface implementations.
• High-density Signal Processing  Substantial embedded RAM and logic resources allow implementation of on-chip buffering, DSP pipelines and algorithm acceleration.
• System Integration & Prototyping  FCBGA surface-mount package and high resource density make the device suitable for integration into complex prototypes and production systems requiring compact footprint and scalability.

Unique Advantages

• High programmable density: 236,000 logic elements provide the headroom to implement large custom logic functions without offloading to external devices.
• Significant on-chip memory: Approximately 13.3 Mbits of embedded RAM reduces dependence on external memory for many buffering and data-processing tasks.
• Extensive I/O resources: 360 I/Os allow wide parallel interfaces and multiple peripheral connections directly to the FPGA fabric.
• Industrial temperature support: Rated from −40°C to 100°C to meet temperature demands of industrial deployments.
• Compact FCBGA packaging: 780-BBGA (780-HBGA, 33×33) with surface-mount mounting enables dense board-level designs while keeping a single-package solution.
• Controlled core power domain: Core voltage specified between 870 mV and 930 mV for predictable power-domain planning and supply design.

Why Choose 5SGSMD3E1H29I2G?

The 5SGSMD3E1H29I2G positions itself as a high-density, industrial-grade Stratix® V GS device for designs that require extensive programmable logic, substantial embedded memory and broad I/O connectivity. Its specification set supports complex implementations where on-chip resources and robust temperature performance are priorities.

This device is well suited to engineering teams developing industrial control systems, communications equipment or high-density signal processing solutions that need a single, integrated FPGA offering large logic and memory resources in a compact surface-mount package.

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