5SGSMD3E2H29C1G

The 5SGSMD3E2H29C1G is a Stratix V GS field-programmable gate array (FPGA) IC from Intel, delivered in a 780-BBGA (FCBGA) package. It provides high logic density and substantial on-chip memory capacity while supporting a large number of I/O pins for complex, I/O-rich designs.

Designed for commercial-temperature systems, this device targets applications that require dense logic resources, embedded memory for buffering or state storage, and flexible I/O integration within a surface-mount 780-HBGA (33×33) footprint.

Key Features

• Logic Capacity — 236,000 logic elements for implementing complex digital designs and extensive custom logic blocks.
• Embedded Memory — Approximately 13.3 Mbits of on-chip RAM to support buffering, lookup tables, and on-chip data storage without external memory.
• I/O Density — 360 user I/O pins to connect multiple peripherals, parallel interfaces, and high-pin-count subsystems.
• Power Supply Range — Core voltage supply specified from 870 mV to 930 mV to match precise low-voltage core requirements.
• Package & Mounting — Supplied in a 780-BBGA (FCBGA) package; supplier device package listed as 780-HBGA (33×33); surface-mount mounting type for PCB assembly.
• Temperature Grade — Commercial grade operation with an ambient operating temperature range of 0 °C to 85 °C.
• Environmental Compliance — RoHS-compliant, supporting regulatory requirements for lead-free manufacturing.

Typical Applications

• High-density digital processing — Use the device’s large logic element count to implement complex state machines, acceleration pipelines, and custom processing cores.
• On-chip buffering and memory handling — Approximately 13.3 Mbits of embedded RAM supports data buffering, LUT storage, and intermediate data retention without immediate reliance on external memory.
• I/O-intensive systems — With 360 I/Os, integrate multiple parallel interfaces, sensor arrays, or interface bridging functions requiring significant pin availability.
• Prototype and platform development — Surface-mount 780-HBGA package enables integration into evaluation boards and platform designs for development and verification.

Unique Advantages

• High logic density: 236,000 logic elements let you consolidate complex functionality into a single device, reducing the need for multiple FPGAs or external glue logic.
• Substantial on-chip memory: Approximately 13.3 Mbits of embedded RAM reduces external memory bandwidth and simplifies board-level memory architecture.
• Extensive I/O support: 360 I/Os enable broad peripheral connectivity and parallel interface implementations without requiring external multiplexing.
• Compact package footprint: 780-BBGA / 780-HBGA (33×33) surface-mount package balances high pin count and board-area efficiency for dense system designs.
• Commercial temperature suitability: Rated for 0 °C to 85 °C operation to match general-purpose commercial electronics deployments.
• Regulatory readiness: RoHS compliance supports lead-free manufacturing and environmental regulations.

Why Choose 5SGSMD3E2H29C1G?

The 5SGSMD3E2H29C1G delivers a balance of high logic capacity, significant embedded memory, and broad I/O capability in a surface-mount 780-BBGA package suitable for commercial-temperature applications. Its specifications make it well suited for designers who need to implement large-scale logic, on-chip buffering, and extensive peripheral connectivity within a single FPGA device.

As a member of the Stratix V family from Intel, this device is supported by documented electrical and switching characteristics for predictable integration into system-level designs, helping teams scale prototypes into production hardware with clear power and thermal parameters.

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