5SGSMD3E2H29C2L

The 5SGSMD3E2H29C2L is a Stratix V GS FPGA in a 780-BBGA (FCBGA) package, designed for high-performance, transceiver‑enabled and DSP-centric applications. Built on the Stratix V family architecture, it targets bandwidth‑centric and data‑intensive systems that require large logic capacity, significant embedded memory, and integrated transceiver/DSP resources.

This commercial‑grade, surface‑mount FPGA offers 236000 logic elements, approximately 13.3 Mbits of embedded memory, 360 I/O pins, and a core voltage supply range of 820 mV to 880 mV—delivering a combination of logic density, on‑chip RAM, and I/O for advanced networking, communications, and compute applications.

Key Features

• Core and Architecture  Stratix V family architecture with a redesigned adaptive logic module (ALM) and comprehensive fabric clocking network.
• Logic Capacity  236000 logic elements to support complex programmable logic and system integration on a single device.
• Embedded Memory  Approximately 13.3 Mbits of on‑chip RAM (Total RAM Bits: 13,312,000) using 20 Kbit (M20K) memory blocks as part of the family architecture.
• DSP and Transceiver Capability  Stratix V GS family offers abundant variable‑precision DSP resources and integrated transceivers with 14.1‑Gbps data rate capability (family capability described in the Stratix V documentation).
• I/O and Package  360 I/O pins in a 780‑BBGA (FCBGA), supplier package 780‑HBGA (33×33), optimized for dense board integration and high‑pin‑count designs.
• Power  Core supply voltage specified from 820 mV to 880 mV for low‑voltage operation.
• Thermal and Mounting  Surface mount package with an operating temperature range of 0 °C to 85 °C; commercial grade.
• Design and Integration  Family features include fractional PLLs, multi‑track routing, and an Embedded HardCopy Block for hard IP integration (as described in Stratix V family documentation).
• Compliance  RoHS compliant.

Typical Applications

• High‑speed networking and switching  Implement packet processing and transport logic for 40G/100G systems using the device’s logic density, I/O, and family transceiver capabilities.
• Bandwidth‑centric I/O systems  Support protocol acceleration such as PCI Express Gen3 and other high‑bandwidth interfaces described for the Stratix V family.
• DSP‑centric compute  Deploy variable‑precision DSP functions and high‑throughput multipliers for signal processing, broadcast, and compute acceleration.
• Prototype to ASIC flow  Use the Stratix V family’s path to HardCopy V ASICs for low‑risk, higher‑volume production migration (family‑level capability).

Unique Advantages

• High logic capacity: 236000 logic elements provide the headroom to integrate complex control, datapath, and protocol functions on a single device.
• Substantial on‑chip RAM: Approximately 13.3 Mbits of embedded memory (M20K blocks) reduce external memory requirements and support large buffering and table storage.
• Transceiver and DSP resources: As a Stratix V GS device, the family provides integrated transceivers and variable‑precision DSP blocks suited for transceiver‑based DSP workloads.
• High I/O density and compact package: 360 I/O in a 780‑BBGA (33×33) package enables dense board layouts for space‑constrained, high‑performance systems.
• Low‑voltage core operation: Core voltage range of 820 mV–880 mV supports low‑power core operation in optimized power budgets.
• Commercial and RoHS compliant: Commercial grade with RoHS compliance simplifies regulatory considerations for mainstream applications.

Why Choose 5SGSMD3E2H29C2L?

The 5SGSMD3E2H29C2L delivers a balance of logic density, embedded memory, I/O capacity, and Stratix V family DSP/transceiver capabilities suitable for demanding networking, communications, and compute designs. Its 780‑BBGA package and 360 I/O pins make it appropriate for high‑pin‑count boards where integration and throughput are primary concerns.

Supported within the Stratix V family ecosystem, this GS variant is a practical choice for teams that need a programmable platform for prototyping DSP‑heavy or bandwidth‑intensive systems and that may plan a future migration to HardCopy ASICs for volume production.

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