5SGSMD3E2H29C2WN

The 5SGSMD3E2H29C2WN is an Intel Stratix® V GS field-programmable gate array (FPGA) offered in a 780-ball BGA (FCBGA) package. The device provides dense programmable logic, significant on‑chip memory, and a large I/O count for commercial-temperature designs.

Designed for applications that require high logic capacity and flexible I/O, this device targets commercial electronic systems where integration density, configurable logic, and on-chip memory are primary requirements.

Key Features

• Logic Capacity  Provides 236,000 logic elements for complex, high-density digital implementations.
• Embedded Memory  Includes approximately 13.3 Mbits of on-chip RAM for buffering, packet processing, or local data storage.
• I/O  Up to 360 device I/O pins to support wide external interfacing and parallel connectivity.
• Power Supply  Core voltage operating range from 870 mV to 930 mV to match system power-rail requirements.
• Package & Mounting  780-BBGA (FCBGA) package; supplier device package listed as 780-HBGA (33×33). Surface-mount device.
• Temperature Grade  Commercial temperature range: 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant.

Typical Applications

• High-density programmable logic  Implement complex state machines, custom datapaths, and logic-rich functions using 236,000 logic elements and abundant on-chip RAM.
• Multi-I/O interface systems  Support systems requiring large numbers of external signals with up to 360 I/O pins for parallel interfaces, control buses, and peripheral aggregation.
• Commercial embedded systems  Deploy in commercial-temperature embedded products that need configurable hardware acceleration and local memory resources.

Unique Advantages

• High logic density: 236,000 logic elements enable consolidation of multiple functions into a single FPGA, reducing board-level component count.
• Substantial on-chip memory: Approximately 13.3 Mbits of embedded RAM supports buffering, packet handling, and intermediate data storage without external memory.
• Extensive I/O support: 360 available I/O pins simplify integration with multiple peripherals and parallel interfaces.
• Compact BGA package: 780-ball FCBGA (33×33) provides a compact footprint for high-density PCB designs while remaining surface-mount friendly.
• Commercial-ready thermal range: Rated for 0 °C to 85 °C operations to match typical commercial electronic products and deployment environments.
• Regulatory readiness: RoHS compliance supports contemporary environmental requirements for electronic assemblies.

Why Choose 5SGSMD3E2H29C2WN?

The 5SGSMD3E2H29C2WN delivers a combination of high logic element count, significant embedded memory, and broad I/O capability in a single Stratix V GS FPGA package. It is positioned for commercial designs that demand configurable hardware resources and substantial on-chip RAM while maintaining a compact BGA footprint.

Engineers and procurement teams seeking a device with a clear specification set—logic capacity, memory size, I/O count, package, operating voltage range, and commercial temperature rating—will find this part suitable for consolidating complex functions, accelerating data-paths, and simplifying board-level integration.

Request a quote or submit a product inquiry today to obtain pricing, availability, and lead-time information for the 5SGSMD3E2H29C2WN.