5SGSMD3E2H29I2G

The 5SGSMD3E2H29I2G is an Intel Stratix® V GS field programmable gate array (FPGA) in a surface-mount 780-BBGA (FCBGA) package. It provides a high-density programmable fabric with 236000 logic elements and approximately 13.312 Mbits of on-chip RAM, paired with 360 general-purpose I/Os.

Specified for industrial-grade operation, this device supports a wide operating temperature range and a tightly-defined core voltage supply, making it suitable for designs that require substantial on-chip logic and memory capacity alongside robust thermal and power characteristics.

Key Features

• Core Logic  236000 logic elements provide large-scale programmable logic capacity for complex designs.
• Embedded Memory  Approximately 13.312 Mbits of on-chip RAM to support data buffering, state storage, and memory-intensive logic functions.
• I/O  360 device I/Os for broad connectivity to external peripherals, interfaces, and board-level signals.
• Package & Mounting  780-BBGA (FCBGA) surface-mount package; supplier device package listed as 780-HBGA (33×33) for board integration planning.
• Power  Core voltage supply range 870 mV–930 mV, enabling precise power planning for the programmable fabric.
• Temperature & Grade  Industrial grade device with an operating temperature range of −40 °C to 100 °C for extended-environment deployment.
• Standards Compliance  RoHS compliant.

Typical Applications

• Custom high-density logic designs  Use the large logic-element count and embedded RAM for complex, board-level programmable functions.
• I/O-intensive systems  Leverage 360 I/Os for dense peripheral interfacing and multi-channel signal aggregation.
• Industrial control and automation  Industrial temperature rating and robust packaging support deployment in extended-temperature control applications.
• Prototyping and integration  Surface-mount 780-BBGA and 33×33 HBGA footprint support standard PCB assembly flows for system prototyping and production.

Unique Advantages

• High logic density: 236000 logic elements accommodate large, multi-function designs without external FPGA partitioning.
• Substantial on-chip memory: Approximately 13.312 Mbits of embedded RAM reduces reliance on external memory for buffering and state storage.
• Extensive I/O count: 360 I/Os simplify board-level connectivity and reduce the need for I/O expanders.
• Industrial temperature capability: −40 °C to 100 °C rating supports reliable operation in harsh or wide-range environments.
• Controlled core voltage: 870 mV–930 mV supply range enables predictable power design for the programmable fabric.
• RoHS compliant: Meets environmental compliance requirements for modern electronics production.

Why Choose 5SGSMD3E2H29I2G?

The 5SGSMD3E2H29I2G combines high programmable logic capacity, significant on-chip RAM, and a large I/O count within an industrial-rated, surface-mount BBGA package. These characteristics make it well-suited for engineers designing dense, I/O-rich systems that require reliable operation across extended temperature ranges.

Backed by the Intel Stratix V family documentation, this device provides a clear specification baseline for power, thermal, and integration planning—helping teams scale hardware designs with predictable electrical and mechanical requirements.

Request a quote to discuss availability, lead times, and pricing for the 5SGSMD3E2H29I2G.