5SGSMD3E2H29C3N

The 5SGSMD3E2H29C3N is a Stratix® V GS field-programmable gate array (FPGA) in a 780‑ball BGA (FCBGA) package targeted at DSP‑centric and transceiver‑based applications. It combines a high logic-element count and substantial on‑chip memory with a large I/O complement and a low core voltage operating window to support data‑intensive designs in commercial environments.

Key Features

• Core architecture — Stratix V family enhancements include a redesigned adaptive logic module (ALM) and a fabric clocking network for high-performance logic implementation.
• Logic density — 236,000 logic elements provide the capacity to implement complex digital designs and large-scale processing pipelines.
• Embedded memory — Approximately 13.31 Mbits of on‑chip RAM (total RAM bits: 13,312,000) for buffering, LUTRAM, and mid‑level storage needs.
• DSP and transceiver capabilities (series‑level) — Stratix V GS devices include variable‑precision DSP blocks and integrated transceivers suitable for transceiver‑based DSP applications as described in the Stratix V family documentation.
• I/O count — 360 user I/Os to support wide parallel interfaces, high pin‑count peripherals, and board‑level routing flexibility.
• Power and voltage — Core supply specified from 820 mV to 880 mV, enabling low‑voltage operation consistent with the device family’s core power architecture.
• Package and mounting — 780‑BBGA, FCBGA (supplier package: 780‑HBGA, 33×33 mm) in a surface‑mount form factor for high‑density PCB integration.
• Operating conditions — Commercial grade with an operating temperature range of 0 °C to 85 °C; RoHS compliant.
• Embedded Hard IP (series‑level) — The Stratix V family documentation describes integrated hard IP blocks and an Embedded HardCopy Block for hardened IP instantiation in production flows.

Typical Applications

• DSP‑centric signal processing — High logic density and substantial embedded memory support complex, variable‑precision digital signal processing pipelines.
• High‑bandwidth communications — The device’s GS‑class transceiver and large I/O complement suit backplane, optical interface, and wireline transport functions.
• Networking and packet processing — Large logic element count and on‑chip RAM enable implementation of packet engines, traffic managers, and protocol offload functions.
• High‑performance compute acceleration — The combination of DSP resources and logic capacity supports acceleration kernels in compute and broadcast processing applications.

Unique Advantages

• High integration density: 236,000 logic elements and substantial embedded RAM reduce the need for external logic and memory components.
• Large I/O capacity: 360 I/Os simplify board partitioning for wide data buses and multi‑lane interfaces.
• Low core voltage operation: 820–880 mV core supply supports designs optimized for lower core power domains.
• Commercial temperature suitability: Rated for 0 °C to 85 °C operation to match typical commercial product deployment profiles.
• RoHS compliant packaging: Surface‑mount 780‑ball BGA (33×33 mm supplier package) for dense PCB layouts and assembly workflows.

Why Choose 5SGSMD3E2H29C3N?

This Stratix V GS device delivers a balance of large logic capacity, significant on‑chip memory, and a high I/O count in a compact 780‑ball BGA package, making it well suited for commercial, DSP‑focused, and high‑bandwidth applications. Its specification for low core voltage operation and the family’s documented hard IP and DSP resources provide a platform for scalable designs that can move from prototype to production while leveraging Stratix V architecture advantages.

Engineers and procurement teams looking for a commercial‑grade FPGA with a focus on transceiver‑aware DSP workloads, extensive logic resources, and a high pin count will find the 5SGSMD3E2H29C3N appropriate for demanding board‑level implementations.

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