5SGSMD3E2H29C3G

The 5SGSMD3E2H29C3G is a Stratix® V GS family FPGA from Intel, delivered in a 780-BBGA (FCBGA) surface-mount package. It provides a high-density programmable logic fabric for commercial-grade digital designs.

Key on-chip resources include approximately 236,000 logic elements and approximately 13.3 Mbits of embedded memory, paired with up to 360 I/Os and low-voltage core operation (820 mV–880 mV). The device is specified for commercial temperature operation (0 °C to 85 °C) and is RoHS compliant.

Key Features

• Core Logic  Approximately 236,000 logic elements for complex, high-density programmable logic implementations.
• Embedded Memory  Approximately 13.3 Mbits of on-chip RAM to support large buffering and on-chip datasets.
• I/O Capacity  Up to 360 user I/Os to support wide parallel interfaces and high-pin-count designs.
• Power  Core voltage supply range of 820 mV to 880 mV for low-voltage operation.
• Package & Mounting  780-BBGA (FCBGA) package; supplier device package listed as 780-HBGA (33×33). Surface-mount package suitable for standard PCB assembly.
• Temperature & Grade  Commercial-grade device rated for 0 °C to 85 °C operation.
• Compliance  RoHS compliant.

Typical Applications

• High-density programmable logic systems  Deploy the device where large logic capacity and embedded memory are required to implement complex digital functions.
• High-pin-count interface designs  Leverage up to 360 I/Os for multi-channel or wide-parallel connectivity and custom interface integration.
• Commercial temperature deployments  Designed for applications and equipment operating in the 0 °C to 85 °C commercial temperature range.

Unique Advantages

• Substantial logic resources:  Approximately 236,000 logic elements enable large-scale logic and custom datapath implementations without external logic expansion.
• Significant on-chip memory:  Approximately 13.3 Mbits of embedded RAM reduce external memory dependency for buffering and on-chip storage.
• High I/O count:  360 I/Os simplify routing of parallel interfaces and multi-channel connectivity, reducing the need for external multiplexing.
• Compact BGA packaging:  780-BBGA FCBGA (780-HBGA, 33×33) provides a high-pin-count solution in a space-efficient footprint for dense PCB designs.
• Low-voltage core operation:  820 mV–880 mV supply range supports designs targeting low core power domains.
• Commercial-grade availability:  Specified for 0 °C to 85 °C operation and RoHS compliant for standard commercial product lifecycles.

Why Choose 5SGSMD3E2H29C3G?

The 5SGSMD3E2H29C3G combines high logic density, substantial embedded memory, and a large I/O complement in a 780-BBGA FCBGA package tailored for commercial applications. Its low-voltage core operation and surface-mount form factor make it suitable for compact, high-performance programmable designs that require on-chip resources and a high pin count.

This device is well suited to teams and projects that need deterministic, on-chip resources—delivering scalability through logic and memory capacity while conforming to commercial temperature and RoHS requirements.

Request a quote or submit an inquiry for pricing and availability to evaluate the 5SGSMD3E2H29C3G for your next high-density programmable design.