5SGSMD3E2H29I2L

The 5SGSMD3E2H29I2L is an Intel Stratix® V GS field programmable gate array supplied in a 780-ball BGA FCBGA package. It is a 28-nm class device from the Stratix V family optimized for transceiver‑based, DSP‑centric applications and high-performance logic integration.

Designed for industrial applications, this device combines high logic capacity, significant on-chip memory, and a transceiver-capable fabric to address wireline, broadcast, military, and high-performance computing use cases where DSP throughput and I/O density matter.

Key Features

• Logic Capacity — 236,000 logic elements for complex custom logic and high-density FPGA implementations.
• Embedded Memory — Approximately 13.3 Mbits of on-chip RAM implemented with M20K (20-Kbit) memory blocks to support large buffering and data processing functions.
• DSP Resources — Stratix V GS family-level support for variable-precision DSP blocks, including up to 3,926 18×18 or 1,963 27×27 multipliers, enabling high‑throughput signal processing designs.
• Transceiver Capability (Family) — Stratix V family includes integrated serial transceivers; GS devices provide transceivers with 14.1‑Gbps data‑rate capability for backplane and optical interfaces.
• Package and I/O — 360 user I/O pins and a 780-ball BGA FCBGA package; supplier package listed as 780-HBGA (33×33), suitable for surface-mount assembly.
• Power and Operating Range — Supported core supply range of 820 mV to 880 mV and operating temperature range from −40 °C to 100 °C for industrial environments.
• Fabric Architecture (Family) — 28-nm TSMC process with adaptive logic modules (ALMs), multi-track routing architecture, fractional PLLs, and an embedded HardCopy block for hardened IP instantiation.
• Compliance — RoHS compliant.

Typical Applications

• High‑performance signal processing — DSP-centric designs that require dense multiplier resources and on-chip memory for real-time filtering, encoding, or channel processing.
• Optical and backplane communications — Transceiver-capable interfaces and abundant I/O for 40G/100G transport, media converters, and optical test equipment.
• Broadcast and video processing — High-throughput processing pipelines and memory buffering for multi‑channel video encoding, decoding, and format conversion.
• Network and packet processing — Packet classification, traffic management, and protocol offload implementations that leverage the device’s logic density and I/O count.

Unique Advantages

• High logic density: 236,000 logic elements enable implementation of large, complex designs without partitioning across multiple devices.
• Significant embedded memory: Approximately 13.3 Mbits of RAM using M20K blocks reduces external memory dependency and improves data‑path latency.
• DSP-focused architecture: Large counts of variable‑precision DSP multipliers support high‑precision, high‑throughput signal processing tasks.
• Transceiver-capable fabric: GS‑class transceivers with 14.1‑Gbps capability facilitate high-speed serial links for backplane and optical interfaces.
• Industrial temperature grade: Rated for −40 °C to 100 °C, suitable for industrial deployment environments.
• Production scaling path: Stratix V family documentation highlights a path to HardCopy V ASICs for volume production, enabling lower‑risk scaling from FPGA prototypes to hardened devices.

Why Choose 5SGSMD3E2H29I2L?

The 5SGSMD3E2H29I2L delivers a balanced combination of logic capacity, embedded memory, and DSP resources in an industrial‑grade Stratix V GS device. Its package and I/O count support dense board-level integration while the device-level features — including M20K memory blocks, ALM-based fabric, and transceiver capability — address demanding DSP and high‑bandwidth interface requirements.

This device is a fit for engineers and system designers targeting transceiver‑based signal processing, network transport, and compute‑intensive applications that require a scalable prototyping-to-production path within the Stratix V family.

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