5SGSMD3E2H29I2LN

The 5SGSMD3E2H29I2LN is an Intel Stratix® V GS field-programmable gate array (FPGA) in a 780-BBGA (FCBGA) package targeted at high-performance, DSP-centric and transceiver-based applications. Built on the Stratix V family architecture, this GS variant combines a high logic count and substantial on-chip memory with integrated transceiver and DSP resources to address bandwidth- and compute-intensive designs.

Key Features

• Core & process — Stratix V family device architecture implemented in 28-nm process technology, delivering the building blocks described for the family.
• Logic capacity — Approximately 236,000 logic elements to implement large, complex FPGA designs.
• Embedded memory — Approximately 13.3 Mbits of on-chip RAM (13,312,000 total RAM bits) using the family’s 20-Kbit embedded memory blocks.
• DSP resources — GS family provides an abundance of variable-precision DSP blocks for high-performance digital signal processing workloads.
• Transceiver capability — GS devices include integrated transceivers with 14.1‑Gbps data-rate capability for high-speed serial interfaces.
• I/O and package — 360 user I/O pins in a 780-BBGA (FCBGA) supplier package 780-HBGA (33×33), surface-mount mounting type for system-level integration.
• Power — Core voltage supply operating range specified at 820 mV to 880 mV for the device.
• Temperature and grade — Industrial-grade device rated for operation from −40 °C to 100 °C.
• Integration and hard IP — Stratix V family includes Embedded HardCopy Block support and a set of integrated hard IP blocks used for IP instantiation and migration paths.

Typical Applications

• High-performance DSP systems — Use the GS variant’s dense DSP resources and embedded memory for compute-intensive signal processing and algorithm acceleration.
• Optical and backplane interfaces — Integrated transceivers with multi-gigabit capability support high-speed serial links for optical transport and backplane applications.
• Networking and packet processing — Large logic capacity and on-chip memory enable complex packet-processing pipelines and high-throughput networking functions.
• Broadcast and military communications — DSP-centric architecture and transceiver support suit modulation, encoding, and other real-time communications processing tasks.

Unique Advantages

• High logic and memory density: Approximately 236,000 logic elements and about 13.3 Mbits of embedded RAM let you map large designs on a single device, reducing board-level complexity.
• DSP-optimized resources: Variable-precision DSP blocks speed implementation of math-intensive kernels such as filtering, transforms, and complex arithmetic.
• Integrated high-speed serial I/O: 14.1‑Gbps-capable transceivers enable direct connection to high-bandwidth links without external SerDes components.
• Industrial temperature rating: −40 °C to 100 °C operation supports deployment in industrial environments requiring extended thermal range.
• System-level packaging: 780-BBGA (33×33) surface-mount package provides dense I/O and a compact footprint for space-constrained, high-performance boards.
• Family-level ecosystem: The Stratix V family architecture and Embedded HardCopy Block support simplify IP reuse and migration across development and production flows.

Why Choose 5SGSMD3E2H29I2LN?

The 5SGSMD3E2H29I2LN brings a balance of high logic count, substantial embedded memory, abundant DSP resources, and multi-gigabit transceivers in an industrial-grade Stratix V GS device. It is suited for engineers designing bandwidth- and compute-intensive systems that require a single, integrated device to minimize board complexity and accelerate time to market.

Choose this device for scalable DSP implementations, high-speed interface designs, and systems where dense logic, robust on-chip memory, and industrial temperature operation are key selection criteria.

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