5SGSMD3E2H29I3L

The 5SGSMD3E2H29I3L is a Stratix® V GS family Field Programmable Gate Array (FPGA) IC in a 780-BBGA FCBGA package. It delivers high logic capacity and embedded memory in a surface-mount, industrial-grade device designed for demanding electronic systems.

With 236,000 logic elements and approximately 13.3 Mbits of embedded RAM, this device targets high-density programmable logic, I/O-intensive designs, and applications that require operation across a wide industrial temperature range.

Key Features

• Core Logic  236,000 logic elements (cells) provide substantial programmable logic resources for complex designs.
• Embedded Memory  Approximately 13.3 Mbits of on-chip RAM to support buffers, FIFOs, and data-path storage.
• I/O Capacity  360 user I/Os to handle wide external connectivity and parallel interfacing needs.
• Package and Mounting  780-BBGA (FCBGA) package; supplier device package noted as 780-HBGA (33×33). Surface-mount mounting type supports compact board-level integration.
• Power and Core Voltage  Core supply voltage range of 820 mV to 880 mV for defined core operating conditions.
• Industrial Temperature Grade  Rated for operation from −40°C to 100°C, suitable for industrial environments.
• Standards and Documentation  Device is part of the Stratix V family; electrical and switching characteristics are documented in the Stratix V device datasheet covering I/O timing and switching behavior.
• RoHS Compliance  RoHS-compliant device for regulatory environmental considerations.

Typical Applications

• Industrial Control & Automation  Industrial temperature rating (−40°C to 100°C) and extensive I/O count make this FPGA suitable for real-time control, motor drives, and factory automation systems.
• High-Density Logic and Acceleration  Large logic element count and on-chip memory enable complex algorithms, data-path acceleration, and custom processing blocks.
• Communications and Infrastructure  As a Stratix V GS family device, it is applicable to communications equipment requiring programmable logic, high channel counts, and configurable I/O timing.
• Prototyping and System Integration  High resource density and broad I/O support make the device useful for prototyping system-level designs and consolidating multiple functions into a single FPGA.

Unique Advantages

• High Logic Capacity: 236,000 logic elements provide the headroom to implement large, multi-function designs on a single device.
• Substantial On‑Chip Memory: Approximately 13.3 Mbits of embedded RAM reduces reliance on external memory for many buffering and streaming tasks.
• Extensive I/O Support: 360 user I/Os allow flexible interfacing to sensors, buses, and peripherals without immediate need for additional I/O expanders.
• Industrial Reliability: −40°C to 100°C operating range and industrial grade designation enable deployment in harsh or temperature-variable environments.
• Compact, Board‑Ready Package: 780‑BBGA FCBGA (supplier 780‑HBGA 33×33) surface-mount package supports dense PCB layouts and simplifies assembly.
• Defined Core Supply Range: 820–880 mV core voltage window provides clear power design parameters for system architects.

Why Choose 5SGSMD3E2H29I3L?

The 5SGSMD3E2H29I3L combines a high logic-element count, significant embedded memory, and extensive I/O in an industrial-grade Stratix V GS FPGA package. Its documented electrical and switching characteristics, along with a defined core voltage range and wide operating temperature, make it a practical choice for engineers designing complex, reliable systems that require programmable logic and strong on-chip resources.

This part is well suited for teams consolidating multiple functions into a single FPGA, engineering industrial equipment, or developing infrastructure and communications hardware that benefits from high logic density and configurable I/O.

Request a quote or submit a procurement inquiry to receive pricing, availability, and lead-time information for the 5SGSMD3E2H29I3L Stratix V GS FPGA.