5SGSMD3E2H29I3LG

The 5SGSMD3E2H29I3LG is an Intel Stratix® V GS family FPGA offered in an industrial temperature grade. It provides high-density logic capacity and on-chip embedded memory in a surface-mount FCBGA package, making it suitable for designs that require large programmable logic resources, significant embedded RAM, and extensive I/O.

Key design attributes include approximately 236,000 logic elements, roughly 13.3 Mbits of embedded memory, 360 user I/O pins, and a 780-BBGA (FCBGA) package. The device operates from a low-voltage core supply and supports extended industrial temperature ranges.

Key Features

• Core capacity  Approximately 236,000 logic elements for complex programmable logic integration and large designs.
• Embedded memory  Approximately 13.3 Mbits of on-chip RAM to support large buffering, state storage, and memory-intensive logic functions.
• I/O resources  360 user I/O pins to support broad external interfacing and parallel connectivity requirements.
• Package and mounting  780-BBGA (FCBGA) package supplied in a 780-HBGA (33×33) format; surface-mount mounting type for modern PCB assembly.
• Core voltage  Low-voltage core supply range of 820 mV to 880 mV for core power management and system-level power budgeting.
• Temperature grade  Industrial operating temperature range from −40°C to 100°C for extended-environment operation.
• Compliance  RoHS-compliant to meet regulatory lead-free requirements.

Unique Advantages

• High-density programmable logic: The large logic element count enables consolidation of complex functions and higher levels of integration on a single device.
• Substantial on-chip memory: Approximately 13.3 Mbits of embedded RAM reduces the need for external memory for many buffering and state storage tasks.
• Extensive I/O capability: 360 I/Os allow flexible connectivity to peripherals, parallel buses, and multi-channel interfaces.
• Industrial-grade temperature tolerance: Rated for −40°C to 100°C to support deployments in demanding environments.
• Compact surface-mount FCBGA package: The 780-ball BGA form factor supports high pin-count routing in a compact footprint for dense board designs.
• Low-voltage core operation: A narrow core supply window (820–880 mV) supports modern low-power system architectures.

Why Choose 5SGSMD3E2H29I3LG?

The 5SGSMD3E2H29I3LG delivers a balance of high logic density, substantial embedded memory, and broad I/O in an industrial-grade Stratix V GS FPGA. Its combination of approximately 236,000 logic elements, ~13.3 Mbits of on-chip RAM, and 360 I/O pins makes it a strong candidate for complex system integration where consolidation and on-chip resources reduce external component count.

Designed for applications requiring extended temperature operation and compact board implementation, this FCBGA-packaged device offers predictable electrical characteristics and package-level scalability consistent with the Stratix V family. It provides a clear upgrade path for designs that need significant programmable logic and embedded memory while remaining compliant with RoHS requirements.

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