5SGSMD3E3H29C2G

The 5SGSMD3E3H29C2G is an Intel Stratix® V GS field-programmable gate array (FPGA) in a 780‑BBGA (FCBGA) package. It delivers high on-chip logic capacity and embedded memory with a 360‑pin I/O footprint, making it suitable for complex, high‑density digital designs.

Designed for commercial applications, this device combines approximately 236,000 logic elements with approximately 13.3 Mbits of embedded memory, operating within a core supply range of 870 mV to 930 mV and a commercial temperature range of 0 °C to 85 °C.

Key Features

• Logic Capacity — Approximately 236,000 logic elements to implement large-scale custom logic and complex datapaths.
• Embedded Memory — Approximately 13.3 Mbits of on‑chip RAM for buffering, state storage, and memory‑intensive functions.
• I/O Count — 360 programmable I/O pins to support wide external connectivity and parallel interfaces.
• Power and Core Supply — Core voltage range of 870 mV to 930 mV to match system power‑rail planning.
• Package & Mounting — 780‑BBGA FCBGA footprint; supplier device package listed as 780‑HBGA (33×33). Surface mount package for standard PCB assembly.
• Temperature & Grade — Commercial grade with an operating temperature range of 0 °C to 85 °C for typical commercial environments.
• Regulatory — RoHS compliant.

Typical Applications

• High-density custom logic — Use the ~236,000 logic elements to implement complex finite state machines, custom accelerators, and deep datapath designs.
• On-chip buffering and memory‑centric designs — Approximately 13.3 Mbits of embedded RAM supports packet buffering, FIFOs, and local data stores.
• Multi‑I/O interface systems — 360 I/Os accommodate wide parallel buses, multi‑lane interfaces, and extensive peripheral connectivity.

Unique Advantages

• High integration density: Large logic element count and substantial embedded memory reduce the need for external FPGA or memory components.
• Flexible I/O capacity: 360 I/Os enable diverse interface options and simplify board-level routing for multi‑channel designs.
• Commercial temperature suitability: Rated for 0 °C to 85 °C, aligning with standard commercial electronics deployment conditions.
• Compact surface‑mount package: 780‑BBGA/780‑HBGA (33×33) packaging supports compact PCB layouts while maintaining high pin density.
• Standards‑conscious supply: RoHS compliance supports environmentally driven manufacturing requirements.

Why Choose 5SGSMD3E3H29C2G?

The 5SGSMD3E3H29C2G positions itself as a high‑capacity Stratix V GS FPGA for commercial designs that require substantial logic resources and embedded memory in a compact BGA package. Its combination of approximately 236,000 logic elements, roughly 13.3 Mbits of on‑chip RAM, and 360 I/Os supports integration of complex functions while reducing external component count.

This device is suited for engineering teams building large FPGA‑based systems where on‑chip resources, package density, and standard commercial operating conditions are primary considerations. With Intel Stratix V family documentation available, designs can leverage established device specifications for system planning and integration.

Request a quote or submit an inquiry to receive pricing, availability, and lead‑time information for the 5SGSMD3E3H29C2G.