5SGSMD3E2H29I3N

The 5SGSMD3E2H29I3N is a Stratix® V GS Field Programmable Gate Array (FPGA) IC in a 780-pin BGA FCBGA package. It provides high logic density and on-chip memory in a surface-mount, industrial-grade FPGA intended for designs that require significant programmable logic resources and extensive I/O.

Key hardware attributes include approximately 236,000 logic elements, about 13.312 Mbits of embedded memory, 360 I/O pins, a low-voltage supply range (820–880 mV), and an industrial operating temperature range of –40 °C to 100 °C.

Key Features

• Stratix V GS architecture High-density Stratix V GS FPGA silicon in the specified part variant.
• Logic capacity Approximately 236,000 logic elements and roughly 89,000 logic blocks for large-scale programmable logic implementation.
• Embedded memory Approximately 13.312 Mbits of on-chip RAM to support buffering, state storage, and memory-intensive algorithms.
• I/O count 360 user I/O pins to support broad peripheral and interface connectivity.
• Power Voltage supply range 820 mV to 880 mV, enabling defined low-voltage core operation.
• Package & mounting 780-BBGA FCBGA package (supplier device package: 780-HBGA, 33×33) designed for surface-mount assembly.
• Temperature & grade Industrial grade with an operating temperature range of –40 °C to 100 °C for deployment in thermally demanding environments.
• Regulatory compliance RoHS compliant.

Unique Advantages

• High programmable density: The combination of ~236k logic elements and ~89k logic blocks supports complex, high-gate-count designs without immediate need for multiple devices.
• Substantial embedded memory: Approximately 13.312 Mbits of on-chip RAM reduces dependence on external memory for many buffering and state storage tasks.
• Extensive I/O support: 360 I/O pins provide flexibility for multi-interface systems and dense connectivity requirements.
• Industrial-temperature operation: Rated for –40 °C to 100 °C, suitable for industrial environments where extended temperature ranges are required.
• Compact, high-pin-count package: The 780-pin BGA FCBGA (33×33 supplier package) delivers high pin density in a surface-mount form factor for space-constrained boards.
• Defined core supply range: The 820–880 mV supply specification clarifies core power requirements for system power budgeting and regulator selection.

Why Choose 5SGSMD3E2H29I3N?

The 5SGSMD3E2H29I3N offers a high-density Stratix V GS FPGA option for designs that demand large programmable logic resources, significant embedded RAM, and a broad set of I/O. Its industrial temperature rating and surface-mount 780-BBGA package make it suitable for rigorous, space-constrained applications that need robust on-chip resources.

This device fits design flows that require substantial logic and memory on a single FPGA and a clearly defined core voltage envelope. Use this part when your project requires a high-capacity FPGA with extensive I/O and industrial-grade operating range backed by the Stratix V device family documentation.

Request a quote or submit a pricing inquiry for the 5SGSMD3E2H29I3N to receive availability and lead-time details for your next design.