5SGSMD3E2H29I3WN

The 5SGSMD3E2H29I3WN is an Intel Stratix® V GS field-programmable gate array (FPGA) offered in a 780-BBGA FCBGA package. This industrial-grade, surface-mount FPGA delivers high logic density, significant on-chip memory, and a large I/O complement for designs that require complex programmable logic and extensive interfacing.

Designed for applications that demand scalable logic resources and robust operating-range support, this device provides a balance of integration and performance while operating from a core supply range of 820 mV to 880 mV and across an industrial temperature window of –40 °C to 100 °C.

Key Features

• Core Logic Density  236,000 logic element cells to implement complex digital functions and deep custom logic networks.
• Embedded Memory  Approximately 13.3 Mbits of on-chip RAM (13,312,000 bits) for buffers, FIFOs, and storage close to logic.
• I/O Count  360 general-purpose I/Os to support broad interfacing with peripherals, high-pin-count buses, and external devices.
• Power Supply  Core voltage supply specified from 820 mV to 880 mV for the device core.
• Package & Mounting  780-BBGA, FCBGA package (supplier device package listed as 780-HBGA, 33 × 33) in a surface-mount form factor for compact board integration.
• Industrial Temperature Grade  Rated for operation from –40 °C to 100 °C, suitable for demanding environmental conditions.
• Stratix V Family Documentation  Covered by the Stratix V device datasheet series that details electrical and switching characteristics for the family.

Typical Applications

• High-density digital processing  Implement large custom datapath and control logic using the device’s 236,000 logic element cells.
• On-chip buffering and memory  Use the approximately 13.3 Mbits of embedded RAM for packet buffering, FIFO staging, and local data storage.
• I/O-heavy interfacing  Deploy in systems requiring many external connections—360 I/Os provide flexibility for parallel buses and multiple peripherals.
• Industrial systems  Designed for industrial environments where the –40 °C to 100 °C operating range and industrial grade are required.

Unique Advantages

• High logic capacity: 236,000 logic element cells allow consolidation of multiple functions into a single programmable device, reducing system complexity.
• Substantial embedded memory: Approximately 13.3 Mbits of on-chip RAM provide local storage for latency-sensitive buffering and look-up table implementations.
• Extensive I/O availability: 360 I/Os enable broad peripheral connectivity and flexible board-level partitioning.
• Industrial robustness: Industrial-grade specification and wide temperature range support deployment in harsh and temperature-variable environments.
• Compact surface-mount packaging: 780-BBGA / 780-HBGA (33×33) package offers a high-pin-count solution in a compact footprint for dense board designs.
• Controlled core voltage: Defined supply range (820 mV–880 mV) supports predictable power design and regulation for the FPGA core.

Why Choose 5SGSMD3E2H29I3WN?

The 5SGSMD3E2H29I3WN combines high logic density, substantial embedded memory, and a large I/O complement in an industrial-grade Stratix V GS FPGA package. It is well suited to designs that require consolidation of complex logic, on-chip data buffering, and extensive external interfacing in a surface-mount form factor.

Backed by Intel’s Stratix V family documentation for electrical and switching characteristics, this device provides a verifiable engineering foundation for mid- to high-density FPGA designs where temperature range, integration, and deterministic supply requirements matter.

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