5SGSMD3E3H29C2LN

IC FPGA 360 I/O 780HBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 360 13312000 236000 780-BBGA, FCBGA

Quantity 713 Available (as of May 4, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package780-HBGA (33x33)GradeCommercialOperating Temperature0°C – 85°C
Package / Case780-BBGA, FCBGANumber of I/O360Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs89000Number of Logic Elements/Cells236000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits13312000

Overview of 5SGSMD3E3H29C2LN – Stratix® V GS FPGA, 236000 logic elements

The 5SGSMD3E3H29C2LN is a Stratix V GS field-programmable gate array (FPGA) in a 780-BBGA FCBGA package, designed for high-performance, DSP-centric and transceiver-based applications. Built on the Stratix V architecture, this device combines a large logic fabric with substantial on-chip memory and integrated transceivers to address bandwidth- and computation-intensive systems.

Key Features

  • Process & core architecture  Stratix V family architecture offering an enhanced core optimized for high-performance logic and DSP workloads.
  • Logic density  236,000 logic elements for complex system integration and high gate-count designs.
  • Embedded memory  Approximately 13.312 Mbits of on-chip RAM (13,312,000 bits) to support large buffering, packet processing, and data-path storage.
  • DSP resources  GS variant devices include a rich array of variable-precision DSP blocks suitable for high-precision digital signal processing tasks.
  • Integrated transceivers  GS devices offer integrated transceivers with 14.1-Gbps data-rate capability for backplane and optical interface applications.
  • I/O and packaging  360 I/O pins in a 780-BBGA (FCBGA) footprint; supplier device package noted as 780-HBGA (33×33). Surface-mount package simplifies board-level integration.
  • Power  Core supply range specified at 820 mV to 880 mV to match platform power budgeting requirements.
  • Operating range & grade  Commercial grade device with operating temperature from 0 °C to 85 °C and RoHS compliance.
  • Embedded Hard IP  Stratix V devices include an Embedded HardCopy Block for hardened IP instantiation, including PCIe Gen1/Gen2/Gen3 implementations.

Typical Applications

  • High-performance DSP systems  Use the abundant variable-precision DSP blocks and large logic capacity for signal processing, image processing, and compute-accelerated workloads.
  • Optical and backplane communications  Integrated 14.1-Gbps transceivers and high I/O count make the device suitable for backplane interfaces, optical transport, and protocol conversion.
  • Networking and packet processing  Large on-chip RAM and dense logic enable buffering, packet inspection, and high-throughput processing in networking equipment.
  • System prototyping and ASIC path  Stratix V devices provide a low-risk path to HardCopy ASICs for volume production while enabling prototyping at scale.

Unique Advantages

  • High logic capacity:  236,000 logic elements let you implement complex control and data-path logic on a single device, reducing board-level complexity.
  • Significant on-chip memory:  Approximately 13.312 Mbits of embedded RAM supports large buffers and state storage without external memory dependencies.
  • Transceiver-enabled bandwidth:  Integrated 14.1-Gbps transceivers enable high-speed serial links for optical and backplane applications, simplifying PHY-level design.
  • Hardened IP support:  Embedded HardCopy Block accommodates hardened PCIe Gen1/Gen2/Gen3 IP instantiations to accelerate system integration.
  • Compact, surface-mount package:  780-BBGA (33×33) package provides a high-pin-count solution in a compact footprint for dense system designs.
  • Commercial-grade, RoHS-compliant:  Designed for commercial applications with RoHS compliance for regulatory and manufacturing alignment.

Why Choose 5SGSMD3E3H29C2LN?

The 5SGSMD3E3H29C2LN positions itself as a high-density Stratix V GS FPGA suitable for DSP-intensive and transceiver-based designs that require substantial logic, embedded memory, and high-speed serial I/O. Its combination of 236,000 logic elements, approximately 13.312 Mbits of on-chip RAM, and integrated 14.1-Gbps transceivers addresses the needs of networking, communications, and high-performance compute applications.

This device is appropriate for development teams seeking a commercial-grade FPGA platform with a clear migration path to HardCopy ASICs for volume production, while benefiting from the Stratix V family’s integrated hard IP and architecture tailored for bandwidth-centric and data-intensive systems.

Request a quote or submit a request for pricing and availability to get detailed lead-time and volume information for the 5SGSMD3E3H29C2LN.

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