5SGSMD3E3H29C3G

The 5SGSMD3E3H29C3G is a Stratix® V GS field-programmable gate array (FPGA) IC in a 780-ball BGA (FCBGA) package. It integrates a large programmable fabric with substantial embedded RAM and plentiful I/O, and includes electrical and switching characteristics that cover core, periphery, and transceiver behavior.

Targeted for commercial-temperature applications, this device offers a combination of logic capacity, on-chip memory, and I/O density that supports complex digital designs where integration and predictable electrical operating conditions are required.

Key Features

• Logic Capacity  236,000 logic elements to implement large-scale programmable logic and custom digital functions.
• Logic Array Blocks  Approximately 89,000 logic blocks for structured resource partitioning and design mapping.
• Embedded Memory  Approximately 13.312 Mbits of embedded RAM to support buffers, FIFOs, and on-chip data storage.
• I/O Density  360 user I/O pins to support wide bus interfaces, multiple peripherals, and high-pin-count connectivity.
• Package & Mounting  780-ball BGA (FCBGA) package; supplier device package listed as 780-HBGA (33×33); surface-mount mounting type for standard PCB assembly.
• Power and Supply Range  Core supply specified from 820 mV to 880 mV, enabling defined low-voltage core operation.
• Temperature and Grade  Commercial grade device rated for 0 °C to 85 °C operating temperature.
• Compliance  RoHS compliant.
• Electrical & Switching Characteristics  Datasheet includes detailed operating-condition, power, and transceiver switching specifications for system-level integration and timing design.

Typical Applications

• High-density digital processing  Large logic element count and on-chip RAM enable implementation of complex FPGA algorithms, state machines, and data-path acceleration.
• Interface aggregation  360 I/Os provide the pin count necessary for wide parallel buses, multi-channel interfaces, or mixed-signal front ends that require many external connections.
• Embedded memory buffering  Approximately 13.312 Mbits of RAM supports temporary data storage, FIFOs, and buffering within throughput-heavy designs.

Unique Advantages

• Substantial logic resources: 236,000 logic elements let you consolidate multiple functions into a single FPGA, reducing board-level complexity.
• Significant embedded memory: Approximately 13.312 Mbits of on-chip RAM reduces dependence on external memory for many buffering and storage needs.
• High I/O count: 360 user I/Os enable dense peripheral and bus connectivity without additional interface chips.
• Defined low-voltage core: Core supply range of 820 mV–880 mV provides a clear electrical envelope for power-supply design and board-level integration.
• Commercial-temperature qualification: Rated for 0 °C to 85 °C operation to match requirements for commercial and many industrial-facing deployments.
• RoHS compliant: Supports lead-free assembly and global environmental requirements.

Why Choose 5SGSMD3E3H29C3G?

The 5SGSMD3E3H29C3G combines a large programmable fabric, ample embedded RAM, and a high I/O count in a 780-ball BGA package, making it suitable for complex, board-level FPGA implementations that demand integration and predictable electrical behavior. Its documented electrical and switching characteristics, including transceiver-related information in the datasheet, help engineers make informed choices for timing and power design.

This device is positioned for designers and teams developing commercial-temperature FPGA systems that require substantial on-chip resources and a compact surface-mount package. The available datasheet material supports system-level integration, verification, and power planning to aid long-term design robustness and scalability.

Request a quote or submit a pricing and availability inquiry to get lead-time and ordering information for the 5SGSMD3E3H29C3G Stratix® V GS FPGA.