5SGSMD3E3H29C3WN

The 5SGSMD3E3H29C3WN is an Intel Stratix V GS family FPGA presented in a 780-BBGA (FCBGA) package. It integrates 236,000 logic elements, approximately 13.3 Mbits of embedded RAM, and 360 user I/Os to support dense, I/O-rich programmable logic designs.

Designed for commercial-grade applications, the device is surface-mountable and operates from a core supply range of 820 mV to 880 mV with an operating temperature range of 0 °C to 85 °C. The package footprint is supplied as a 780-HBGA (33×33) format.

Key Features

• Core Logic 236,000 logic elements for implementing complex digital functions and wide parallelism in programmable designs.
• Embedded Memory Approximately 13.3 Mbits of on-chip RAM to support buffering, FIFOs, and local storage for algorithms.
• I/O Capacity 360 user I/Os to accommodate multi-channel interfaces and dense system-level connectivity.
• Package & Mounting 780-BBGA, FCBGA package; supplier device package listed as 780-HBGA (33×33). Surface-mount device for compact PCB integration.
• Power Core voltage supply range of 820 mV to 880 mV to align with Stratix V GS device power domains.
• Temperature & Compliance Commercial grade with an operating temperature range of 0 °C to 85 °C and RoHS compliance.

Typical Applications

• High-density programmable logic — Leverage 236,000 logic elements and substantial on-chip RAM to implement complex digital processing blocks and custom accelerators.
• I/O-intensive systems — 360 user I/Os provide the capacity needed for multi-channel data acquisition, aggregation, and peripheral interfacing.
• Memory-dependent functions — Approximately 13.3 Mbits of embedded RAM supports low-latency buffering, lookup tables, and state storage for real-time processing.

Unique Advantages

• High logic density: Large logic element count enables consolidation of multi-chip designs into a single FPGA footprint.
• Significant on-chip memory: Built-in RAM reduces dependency on external memory, improving latency and simplifying board design.
• Extensive I/O capability: 360 I/Os help minimize the need for external multiplexers and bridge devices when interfacing many signals.
• Compact BGA packaging: 780-BBGA (33×33) package supports high-density PCB layouts while retaining thermal and signal integrity characteristics typical of FCBGA designs.
• Commercial readiness: Rated for 0 °C to 85 °C operation and RoHS compliant to meet standard commercial product requirements.

Why Choose 5SGSMD3E3H29C3WN?

The 5SGSMD3E3H29C3WN positions itself as a high-density, I/O-rich Stratix V GS FPGA suitable for commercial designs that require substantial on-chip logic and memory. Its combination of 236,000 logic elements, approximately 13.3 Mbits of embedded RAM, and 360 user I/Os delivers a balanced platform for integrating complex digital systems while reducing external components.

Engineers seeking a surface-mount, RoHS-compliant Stratix V GS device with a compact 780-BBGA package and a defined commercial operating range will find this part suitable for a range of programmable logic applications where integration density and on-chip memory are priorities.

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