5SGSMD3E3H29I3G

IC FPGA 360 I/O 780HBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 360 13312000 236000 780-BBGA, FCBGA

Quantity 1,528 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package780-HBGA (33x33)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case780-BBGA, FCBGANumber of I/O360Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs89000Number of Logic Elements/Cells236000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits13312000

Overview of 5SGSMD3E3H29I3G – Stratix® V GS FPGA, 360 I/Os, 236,000 logic elements, 780‑BBGA

The 5SGSMD3E3H29I3G is a Stratix V GS Field Programmable Gate Array (FPGA) IC designed for industrial-grade applications. It provides a large programmable fabric with 236,000 logic elements and approximately 13.3 Mbits of embedded memory to support complex digital designs.

With 360 user I/Os, a 780‑BBGA FCBGA package (supplier device package: 780‑HBGA, 33×33), an industrial operating temperature range of –40 °C to 100 °C, and a core supply range of 820 mV to 880 mV, this device targets designs that require substantial logic capacity, significant on‑chip RAM, and robust thermal performance.

Key Features

  • Programmable Logic 236,000 logic elements (cells) provide extensive capacity for implementing complex state machines, datapaths, and custom processing blocks.
  • Embedded Memory Approximately 13.3 Mbits of on‑chip RAM for buffering, FIFOs, and local data storage within your logic fabric.
  • High I/O Count 360 user I/Os to support wide parallel interfaces, multiple peripherals, and flexible board-level connectivity.
  • Power and Core Supply Core voltage range of 820 mV to 880 mV to match system power domains and allow precise power planning for the FPGA core.
  • Package and Mounting 780‑BBGA, FCBGA package (supplier package: 780‑HBGA, 33×33) for surface-mount PCB assembly and high-density board layouts.
  • Industrial Temperature Grade Rated for operation from –40 °C to 100 °C, suitable for industrial environments that require extended temperature tolerance.
  • Environmental Compliance RoHS compliant to meet standard environmental and materials requirements.

Typical Applications

  • Industrial embedded systems — Use the device’s industrial temperature rating, large logic capacity, and on‑chip memory for control, monitoring, and automation logic.
  • Custom digital processing — Implement specialized datapaths, protocol processing, and real‑time logic using the extensive logic fabric and embedded RAM.
  • High‑density I/O systems — Deploy the 360 I/Os for boards requiring wide parallel interfaces or multiple peripheral connections.

Unique Advantages

  • Large programmable fabric: 236,000 logic elements enable substantial integration of custom logic, reducing the need for multiple discrete devices.
  • Significant on‑chip memory: Approximately 13.3 Mbits of embedded RAM minimizes external memory dependence for buffering and state retention.
  • High I/O availability: 360 user I/Os offer flexible system interfacing options for complex board-level designs.
  • Industrial-rated thermal range: –40 °C to 100 °C supports deployment in harsh or temperature-variable environments.
  • Low-voltage core operation: 820–880 mV supply range allows integration into modern low-voltage power architectures.
  • RoHS compliant: Meets common environmental requirements for electronics manufacturing.

Why Choose 5SGSMD3E3H29I3G?

The 5SGSMD3E3H29I3G positions itself as a robust, industrial-grade Stratix V GS FPGA option for designs that demand a large logic fabric, substantial on‑chip memory, and a high I/O count. Its combination of 236,000 logic elements, approximately 13.3 Mbits of embedded RAM, and 360 I/Os makes it suitable for integrating complex digital functions into a single device while accommodating industrial temperature requirements.

For engineering teams and procurement focused on scalable, reliable programmable logic solutions, this part offers clear, verifiable specifications for sizing, thermal planning, and board-level integration within supported power and package constraints.

Request a quote or submit a request for pricing and availability for part number 5SGSMD3E3H29I3G to evaluate fit for your next design.

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