5SGSMD3E3H29I3LN

The 5SGSMD3E3H29I3LN is a Stratix V GS Field Programmable Gate Array (FPGA) IC designed for high-density, industrial-grade applications. It combines a large logic fabric, substantial on-chip RAM, and extensive I/O in a 780-ball FCBGA package for surface-mount assembly.

This device is suited to system designs that require significant programmable logic capacity, plentiful embedded memory, and robust I/O counts while operating across an industrial temperature range. The device’s electrical characteristics and switching behavior are covered in the Stratix V device documentation for design verification and integration.

Key Features

• Logic Capacity  Provides 236000 logic elements to support complex digital designs and large-scale custom logic implementations.
• Embedded Memory  Approximately 13.3 Mbits of on-chip RAM to store intermediate data, buffers, and state for compute-intensive functions.
• I/O Density  360 I/Os to connect multiple peripherals, bus interfaces, and external devices without extensive external glue logic.
• Package  780-BBGA FCBGA package (supplier device package: 780-HBGA, 33×33) for high-pin-count, compact board integration; surface mount mounting type.
• Power  Core voltage supply range of 820 mV to 880 mV to match low-voltage system power architectures.
• Industrial Temperature Grade  Rated for operation from –40 °C to 100 °C for deployment in industrial environments.
• RoHS Compliant  Manufactured to meet RoHS requirements.

Typical Applications

• High-density digital signal processing  Use the large logic count and embedded RAM to implement DSP pipelines, custom filters, and real-time processing blocks.
• Networking and communications equipment  Plentiful I/O and large logic resources support packet processing, protocol handling, and interface bridging.
• Industrial control and automation  Industrial temperature rating and robust I/O count enable deployment in factory automation, motion control, and machine vision systems.
• Embedded system integration  Integrate peripherals, custom accelerators, and control logic into a single FPGA-based subsystem to reduce board-level complexity.

Unique Advantages

• High logic density: 236000 logic elements enable implementation of complex state machines, accelerators, and multi-function systems on a single device.
• Substantial on-chip RAM: Approximately 13.3 Mbits of embedded memory reduces dependence on external memory for buffering and intermediate storage.
• Extensive I/O capacity: 360 available I/Os support multiple interfaces and parallel connections without extra I/O expanders.
• Industrial-ready thermal range: –40 °C to 100 °C operation helps ensure reliability in industrial deployment environments.
• Compact, high-pin-count package: 780-ball FCBGA (33×33) delivers dense connectivity in a compact footprint for space-constrained boards.
• Low-voltage core compatibility: Core supply range (820 mV–880 mV) aligns with modern low-voltage system designs to simplify power delivery.

Why Choose 5SGSMD3E3H29I3LN?

This Stratix V GS FPGA balances high logic capacity, significant embedded memory, and abundant I/O in an industrial-grade package, making it a strong candidate for demanding system designs that require on-device programmability and integration. Its electrical and switching characteristics are documented within the Stratix V device datasheet to support detailed design and verification.

Choose the 5SGSMD3E3H29I3LN when you need a high-density, industrial-grade FPGA that supports complex logic implementations, extensive interfacing, and robust operation across a wide temperature range while maintaining a compact package footprint.

Request a quote or submit an RFQ to get pricing and availability for the 5SGSMD3E3H29I3LN and discuss how it can fit into your next design.