5SGSMD3E3H29I4G

The 5SGSMD3E3H29I4G is an Intel Stratix® V GS FPGA offered in an industrial-grade configuration. This high-density programmable device delivers a combination of large logic capacity, substantial on-chip memory, and a high I/O count in a compact surface-mount FCBGA package.

Designed for applications that require significant programmable logic and robust operating conditions, the device provides integrated resources that support complex digital systems and industrial deployments while maintaining RoHS compliance.

Key Features

• Core logic  236,000 logic elements for implementing complex FPGA designs and large-scale digital functions.
• Embedded memory  Approximately 13.3 Mbits of on-chip RAM bits to support buffering, LUTs and memory-intensive algorithms.
• I/O density  360 dedicated I/O pins to accommodate broad interfacing needs with peripherals and system-level signals.
• Power  Core supply range of 820 mV to 880 mV to match low-voltage core domains.
• Package & mounting  780-BBGA (FCBGA) surface-mount package; supplier device package listed as 780-HBGA (33×33) for compact board-level integration.
• Industrial temperature range  Rated for operation from –40 °C to 100 °C, suitable for demanding environments.
• Compliance  RoHS compliant, meeting common environmental requirements for lead-free assembly.
• Documentation coverage  Device electrical and switching characteristics are documented in the Stratix V device datasheet for detailed design reference.

Typical Applications

• Industrial control and automation  Use the device’s high logic capacity and industrial temperature rating to implement control algorithms, I/O aggregation, and custom automation logic.
• High-performance signal processing  Leverage the large logic element count and embedded RAM to build data-paths, DSP blocks, and streaming processing pipelines.
• System integration and prototyping  Combine abundant logic and 360 I/Os to consolidate multiple functions onto a single FPGA for rapid prototyping and system consolidation.
• Communications and networking equipment  The device’s density and I/O count enable implementation of protocol handling, packet processing, and interface bridging in infrastructure designs.

Unique Advantages

• High logic density: 236,000 logic elements enable large designs and higher integration on a single device, reducing board-level component count.
• Significant embedded memory: Approximately 13.3 Mbits of on-chip RAM supports buffering, look-up tables, and memory-hungry functions without immediate external memory dependence.
• Extensive I/O capability: 360 I/Os provide flexible interfacing options for sensors, peripherals, and system buses.
• Industrial-grade robustness: Rated for –40 °C to 100 °C operation, allowing deployment in a wide range of industrial environments.
• Compact surface-mount package: 780-BBGA FCBGA footprint enables dense PCB implementations while supporting high pin count.
• Low-voltage core operation: 820 mV to 880 mV supply range aligns with modern low-voltage FPGA core domains for power-efficient designs.

Why Choose 5SGSMD3E3H29I4G?

The 5SGSMD3E3H29I4G positions itself as a high-density, industrial-grade Stratix V GS FPGA that balances large programmable logic capacity, meaningful on-chip memory, and extensive I/O in a compact BGA package. These characteristics make it suitable for engineers seeking to integrate complex digital functions into ruggedized systems.

With detailed electrical and switching characteristics available in the Stratix V device documentation and RoHS compliance, this device supports scalable designs where reliability, integration, and long-term availability are key considerations.

Request a quote or submit a procurement inquiry today to evaluate 5SGSMD3E3H29I4G for your next design.