5SGSMD3E3H29I3LG

The 5SGSMD3E3H29I3LG is a Stratix V GS Field Programmable Gate Array (FPGA) device offering a high count of programmable logic and on-chip memory in a 780-ball BGA package. It is a surface-mount, industrial-grade FPGA with a broad operating range intended for applications that require substantial logic capacity, embedded memory, and extensive I/O.

This device is part of the Stratix V family and delivers a combination of logic resources, embedded RAM, and I/O density suitable for complex digital designs where integration and thermal/voltage operating ranges are key considerations.

Key Features

• Logic Capacity  Approx. 236,000 logic elements for implementing large-scale programmable logic and complex state machines.
• Configurable Logic Blocks  Approximately 89,000 LABs/CLBs equivalent to support wide logic partitioning and hierarchical design.
• Embedded Memory  Approximately 13.3 Mbits of on-chip RAM providing local storage for buffering, caching, and algorithm state.
• I/O Density  360 user I/Os to support extensive peripheral, bus, or multi-channel interfacing directly from the FPGA.
• Power Supply  Core voltage range of 820 mV to 880 mV to match system power-rail planning and device power domains.
• Package & Mounting  780-ball BGA (FCBGA / supplier package 780-HBGA 33×33) in a surface-mount form factor for high-density PCB integration.
• Industrial Temperature Grade  Rated for operation from –40 °C to 100 °C for deployment in industrial environments.
• Compliance  RoHS compliant.

Typical Applications

• High-density digital processing  Implement large-scale state machines, accelerators, and custom logic functions using the device's extensive logic elements and embedded memory.
• I/O-intensive systems  Support designs that require hundreds of general-purpose I/Os for sensors, interfaces, or multi-channel front-ends.
• Industrial embedded systems  Deploy in applications that benefit from an industrial temperature range (–40 °C to 100 °C) and surface-mount BGA packaging.

Unique Advantages

• Substantial logic capacity: Approx. 236,000 logic elements enable complex designs without extensive external logic.
• Generous embedded memory: Approximately 13.3 Mbits of on-chip RAM reduce the need for external memory for many buffering and algorithmic tasks.
• High I/O count: 360 user I/Os simplify integration with multiple peripherals and parallel interfaces.
• Industrial temperature support: –40 °C to 100 °C rating makes the device suitable for thermally demanding and outdoor industrial deployments.
• Compact, board-ready package: 780-BBGA (33×33) surface-mount package facilitates high-density PCB layouts.
• RoHS compliance: Meets regulatory requirements for lead-free assemblies.

Why Choose 5SGSMD3E3H29I3LG?

The 5SGSMD3E3H29I3LG offers a balance of large programmable logic, substantial embedded memory, and high I/O density in a compact surface-mount BGA package suited to industrial temperature environments. This combination supports designers building complex digital systems that require integrated memory and extensive interfacing while operating across a wide temperature and core-voltage range.

Its placement within the Stratix V family provides a consistent platform for scaling designs that need significant on-chip resources, making it appropriate for teams focused on high-density FPGA implementations and industrial embedded applications.

Request a quote or submit your procurement request to evaluate the 5SGSMD3E3H29I3LG for your next design. Our team can provide pricing, availability, and additional technical documentation upon request.