5SGSMD3E3H29I3N

The 5SGSMD3E3H29I3N is a Stratix® V GS family FPGA offered in an industrial temperature grade and a high-density 780-ball BGA package. It provides a large on-chip logic resource and embedded memory capacity suitable for complex digital designs that require substantial I/O and long-term reliability in industrial environments.

With 236,000 logic elements, approximately 13.312 Mbits of embedded RAM, and up to 360 programmable I/O, this device targets designs that need significant logic density, extensive on-chip memory, and a broad I/O complement within a surface-mount FCBGA package.

Key Features

• Core Logic  236,000 logic elements to implement wide-ranging combinational and sequential logic functions.
• Embedded Memory  Approximately 13.312 Mbits of on-chip RAM for buffering, packet storage, and state data.
• I/O Capability  360 general-purpose I/O pins to support dense external connectivity and multi-channel interfaces.
• Package & Mounting  780-BBGA FCBGA package; supplier device package listed as 780-HBGA (33×33). Surface-mount mounting simplifies board assembly for compact, high-density designs.
• Power  Voltage supply range of 820 mV to 880 mV to meet the device’s operating requirements.
• Temperature Grade  Industrial operating temperature range from −40°C to 100°C for deployments requiring extended temperature tolerance.
• Compliance  RoHS compliant to meet current environmental regulations.

Typical Applications

• High-density digital processing  Implement complex logic, state machines, and datapath functions leveraging 236,000 logic elements and substantial embedded RAM.
• Industrial control & automation  Use in control systems that benefit from industrial temperature range (−40°C to 100°C) and extensive I/O connectivity.
• Communications and networking  Deploy where many I/O channels and on-chip memory are required for buffering and protocol handling.

Unique Advantages

• High logic density: 236,000 logic elements enable consolidation of large functions onto a single device, reducing board-level complexity.
• Significant on-chip memory: Approximately 13.312 Mbits of embedded RAM supports substantial buffering and local data storage without external memory.
• Large I/O count: 360 I/O pins provide flexibility for multi-channel interfaces and parallel connectivity to peripherals and subsystems.
• Industrial-temperature operation: Rated from −40°C to 100°C for reliable operation in demanding thermal environments.
• Compact BGA packaging: 780-ball FCBGA (780-HBGA supplier package, 33×33) enables high-density PCB layouts while supporting surface-mount assembly.
• Regulatory compliance: RoHS compliance simplifies integration into products targeting regulated markets.

Why Choose 5SGSMD3E3H29I3N?

The 5SGSMD3E3H29I3N balances high logic capacity, substantial embedded memory, and broad I/O in a robust industrial-temperature FPGA package. Its combination of 236,000 logic elements, approximately 13.312 Mbits of on-chip RAM, and 360 I/O makes it suitable for engineers consolidating complex digital systems onto a single programmable device while maintaining board-area efficiency with a 780-ball BGA surface-mount package.

This device is well suited to development teams and designs that prioritize integration, on-chip memory resources, and operation across an extended temperature range, delivering a scalable platform for medium- to high-complexity FPGA implementations.

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