5SGSMD3E3H29I4N

IC FPGA 360 I/O 780HBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 360 13312000 236000 780-BBGA, FCBGA

Quantity 92 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package780-HBGA (33x33)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case780-BBGA, FCBGANumber of I/O360Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs89000Number of Logic Elements/Cells236000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits13312000

Overview of 5SGSMD3E3H29I4N – Stratix® V GS Field Programmable Gate Array (FPGA) IC 360 13312000 236000 780-BBGA, FCBGA

The 5SGSMD3E3H29I4N is a Stratix V GS series Field Programmable Gate Array (FPGA) offered in an industrial temperature grade. It provides a high-density, reconfigurable logic fabric with substantial on-chip memory and abundant I/O for complex digital designs.

With specifications that include 236,000 logic elements, approximately 13.3 Mbits of embedded memory, and 360 I/O pins in a 780-ball FCBGA package, this device is suited for industrial FPGA deployments requiring large logic capacity, broad I/O connectivity, and a wide operating temperature range.

Key Features

  • Logic Capacity  236,000 logic elements provide a spacious programmable fabric for implementing complex logic, state machines, and custom processing pipelines.
  • Logic Array Blocks (LABs)  Approximately 89,000 LABs (logic array blocks) to organize and optimize logic placement and routing.
  • Embedded Memory  Approximately 13.3 Mbits of on-chip RAM to support large buffering, FIFOs, and local data storage without external memory.
  • I/O Count  360 dedicated I/O pins to interface with high-channel-count sensor arrays, peripherals, or parallel buses.
  • Power Supply  Core supply operating range from 820 mV to 880 mV to match defined system power rails and power-management strategies.
  • Package and Mounting  780-BBGA (FCBGA) package, supplier device package 780-HBGA (33×33), designed for surface-mount PCB assembly.
  • Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
  • RoHS Compliance  Device is RoHS compliant, supporting current hazardous-substance requirements.

Typical Applications

  • Industrial Control Systems  Industrial-grade temperature range and extensive I/O make this FPGA suitable for factory automation, motion control, and PLC integration.
  • High-Density Digital Processing  Large logic element count and significant embedded memory enable complex signal processing, data aggregation, and custom compute blocks.
  • Communication and Networking Equipment  High I/O count and Stratix V family capabilities support packet processing, protocol bridging, and interface aggregation in network systems.
  • Instrumentation and Test Equipment  The combination of logic resources, memory, and I/O density supports custom measurement, real-time data capture, and control logic.

Unique Advantages

  • High Logic Density: 236,000 logic elements enable integration of complex functionality on a single device, minimizing external components.
  • Generous On-Chip Memory: Approximately 13.3 Mbits of embedded RAM reduces dependence on external memory for buffering and accelerates local data paths.
  • Wide I/O Capability: 360 I/O pins provide flexible connectivity for multi-channel interfaces and parallel subsystems.
  • Industrial Reliability: −40 °C to 100 °C operating range and industrial grade designation support deployment in demanding environments.
  • Compact, Surface-Mount Package: 780-ball FCBGA (33×33) package delivers high pin count in a form factor optimized for PCB assembly.
  • Compliance-Ready: RoHS compliance supports regulatory and manufacturing requirements for many industrial products.

Why Choose 5SGSMD3E3H29I4N?

The 5SGSMD3E3H29I4N combines Stratix V GS family architecture with a high logic element count, substantial embedded memory, and a large I/O complement within an industrial-grade FPGA package. It is positioned for designs that require significant on-chip resources, robust I/O connectivity, and reliable operation across a broad temperature range.

This device is well suited to engineering teams building industrial control, communications, high-density processing, or instrumentation systems that benefit from integrated programmability, on-chip memory, and RoHS-compliant manufacturing.

Request a quote or submit an RFQ to obtain pricing and availability for the 5SGSMD3E3H29I4N. Our team can provide ordering information and support for integrating this Stratix® V GS FPGA into your design.

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