5SGSMD3H1F35C1WN

The 5SGSMD3H1F35C1WN is a Stratix V GS Field Programmable Gate Array (FPGA) IC from Intel, delivered in a 1152-ball FCBGA package. It provides substantial on-chip logic and embedded memory capacity along with a high I/O count for complex digital designs.

Designed for commercial-grade systems, this device targets designs that require large programmable logic capacity, significant embedded RAM, and broad external interfacing while operating within a 0°C to 85°C temperature range.

Key Features

• Logic Capacity  Approximately 236,000 logic elements to implement large-scale programmable logic and complex RTL functions.
• Embedded Memory  Approximately 13.3 Mbits of on-chip RAM for buffering, packet processing, or intermediate data storage within the FPGA fabric.
• I/O Density  432 user I/O pins to support wide parallel interfaces and diverse system connectivity.
• Package & Mounting  1152-ball BGA (FCBGA) package, supplier package specified as 1152-FBGA (35×35), supplied for surface-mount assembly.
• Power Supply  Core supply voltage range: 870 mV to 930 mV, enabling defined power-domain design and verification.
• Temperature & Grade  Commercial grade device rated for operation from 0°C to 85°C.
• Regulatory  RoHS compliant.

Typical Applications

• High-density programmable logic  Implement complex digital functions and custom accelerators using the device's large logic element count and embedded memory.
• I/O‑intensive systems  Use the 432 I/O pins to interface with wide buses, parallel sensors, or multi-channel front-ends.
• Commercial embedded platforms  Deploy in commercial-temperature embedded systems where the 0°C to 85°C rating and surface-mount FCBGA package meet board-level requirements.

Unique Advantages

• High logic density: The approximately 236,000 logic elements enable consolidation of multiple functions into a single FPGA, reducing external component count.
• Generous on-chip RAM: Approximately 13.3 Mbits of embedded memory supports large buffering and state storage without external memory dependence.
• Broad external interfacing: 432 I/O pins provide flexibility to connect to multiple peripherals, interfaces, and board subsystems.
• Compact FCBGA package: The 1152-ball FCBGA (35×35) package offers a dense, surface-mount form factor for space-constrained PCBs.
• Defined power envelope: Core voltage range of 870 mV to 930 mV supports controlled power budgeting and verification in system design.
• RoHS compliant: Meets regulatory requirements for lead-free manufacturing processes.

Why Choose 5SGSMD3H1F35C1WN?

The 5SGSMD3H1F35C1WN combines substantial logic resources, multi-megabit embedded memory, and a high I/O count in a commercial-temperature, surface-mount FCBGA package. It is well suited for designers who need to integrate large-scale programmable logic and local memory while maintaining extensive external connectivity on compact PCBs.

Backed by Stratix V device documentation, this FPGA provides the measurable specifications engineers require for system-level power, thermal, and I/O planning during design and verification.

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