5SGSMD3H1F35C2G

The 5SGSMD3H1F35C2G is a Stratix V GS field-programmable gate array (FPGA) IC designed for commercial-grade, high‑density logic implementations. It delivers a large logic fabric, substantial on‑chip memory, and a high I/O count in a 1152-ball FCBGA package for surface-mount assembly.

This device is intended for designs that require significant logic capacity, embedded RAM, and wide peripheral connectivity while operating within standard commercial temperature and core‑voltage ranges.

Key Features

• Logic Capacity  Approximately 236,000 logic elements to implement complex combinational and sequential logic.
• Embedded Memory  Approximately 13.3 Mbits of on‑chip RAM for large buffering, state storage, and data processing.
• I/O Resources  432 user I/O pins to support extensive peripheral interfacing and multi‑lane parallel or serial connections.
• Power and Core Voltage  Core supply range 870 mV to 930 mV, enabling defined power‑domain design and supply planning.
• Package & Mounting  1152‑FBGA supplier device package (35×35) / 1152‑BBGA FCBGA package case; surface‑mount mounting type suited for modern PCB assembly.
• Temperature & Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Standards Compliance  RoHS compliant to support regulatory and environmental requirements.
• Stratix V Family  Part of the Stratix V GS device family; refer to the Stratix V device datasheet for detailed electrical and switching characteristics.

Typical Applications

• High‑density logic systems  Implement large-scale custom processing and control logic using the device's substantial logic element count and on‑chip RAM.
• Data buffering and packet processing  Use embedded memory and numerous I/Os for buffering, packet handling, and interface bridging in communication equipment.
• Signal processing and algorithm acceleration  Deploy custom DSP blocks and state machines that benefit from a large logic fabric and integrated RAM resources.

Unique Advantages

• High logic density: The ~236,000 logic elements enable implementation of complex functions and extensive custom IP in a single device.
• Significant embedded memory: Approximately 13.3 Mbits of on‑chip RAM reduces external memory requirements and simplifies board-level design.
• Generous I/O count: 432 I/Os allow broad peripheral connectivity and flexible interface partitioning without sacrificing signal routing options.
• Compact FCBGA package: 1152‑ball FCBGA (supplier package 1152‑FBGA 35×35) balances high I/O density with a surface‑mount form factor compatible with modern assembly flows.
• Defined commercial operating window: Commercial grade and a 0 °C to 85 °C operating range provide clear thermal planning parameters for system designers.
• RoHS compliance: Meets environmental requirements for lead‑free assembly and procurement specifications.

Why Choose 5SGSMD3H1F35C2G?

The 5SGSMD3H1F35C2G brings a large, integrated FPGA resource set—high logic element count, sizable embedded RAM, and extensive I/O—in a single commercial‑grade FCBGA package. Its specified core voltage range and operating temperature make it straightforward to integrate into power‑managed designs targeting complex digital processing, buffering, and interface tasks.

This device is well suited to engineering teams and procurement groups looking for a high‑capacity Stratix V GS FPGA that simplifies board architecture by consolidating logic and memory, while providing clear electrical and thermal parameters for system validation.

Request a quote or submit an inquiry to receive pricing, lead‑time information, and availability for the 5SGSMD3H1F35C2G. Our team can assist with order submission and technical documentation requests.