5SGSMD3H1F35C2N

IC FPGA 432 I/O 1152FBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 432 13312000 236000 1152-BBGA, FCBGA

Quantity 1,216 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O432Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs89000Number of Logic Elements/Cells236000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits13312000

Overview of 5SGSMD3H1F35C2N – Stratix® V GS FPGA, 1152-BBGA FCBGA (35×35)

The 5SGSMD3H1F35C2N is a Stratix V GS field-programmable gate array (FPGA) optimized for DSP-centric and transceiver-based applications. Built on the Stratix V family architecture, it combines large logic capacity with abundant on-chip memory and high-speed I/O to address bandwidth- and compute-intensive designs.

This device targets markets that require high precision digital signal processing, backplane and optical interfaces, and data throughput, offering a balance of performance, integration, and commercial-grade operation.

Key Features

  • Logic Capacity — 236,000 logic elements to implement complex programmable logic and custom processing pipelines.
  • Embedded Memory — Approximately 13.3 Mbits of on-chip RAM (13,312,000 bits) for buffering, FIFOs, and large on-die data structures.
  • DSP Resources — Stratix V GS family devices include variable-precision DSP blocks; GS devices support up to 3,926 18×18 or 1,963 27×27 multipliers for high-performance DSP algorithms.
  • High-speed Transceivers — GS variant includes integrated transceivers with 14.1‑Gbps data-rate capability for backplane and optical interface applications.
  • I/O Density — 432 I/O pins to support broad peripheral and interface connectivity requirements.
  • Process and Core Voltage — 28-nm TSMC process technology with device core voltages around 0.85 V or 0.9 V; this part’s documented supply range is 870 mV to 930 mV.
  • Package & Mounting — 1152-ball BBGA, FCBGA footprint; supplier package listed as 1152-FBGA (35×35). Surface-mount mounting type.
  • Operating Conditions — Commercial grade with an operating temperature range of 0 °C to 85 °C and RoHS compliance.

Typical Applications

  • High-performance DSP systems — Use the abundant DSP blocks and large on-chip RAM to implement multi-channel filters, FFTs, and precision signal-processing pipelines.
  • Optical and Backplane Interfaces — Integrated 14.1‑Gbps transceivers enable implementation of 40G/100G interfaces and high-speed serial links for packet processing and transport equipment.
  • Network and Telecom Equipment — High logic density and I/O count support complex packet processing, traffic management, and protocol offload functions.
  • Compute Acceleration — Combine logic elements, DSP multipliers, and embedded memory for application-specific acceleration in broadcast, test, and communications systems.

Unique Advantages

  • Large, programmable fabric: 236,000 logic elements enable integration of substantial custom logic and state machines within a single device, reducing board-level complexity.
  • Significant on-chip memory: Approximately 13.3 Mbits of embedded RAM provide local storage for buffering and latency-sensitive data, minimizing external memory dependence.
  • Dedicated DSP capability: GS family DSP resources (supporting thousands of multipliers) accelerate multiply-accumulate workloads common in signal processing and compute tasks.
  • High-speed serial I/O: Integrated transceivers with 14.1‑Gbps capability simplify implementation of high-bandwidth links for optical and backplane systems.
  • Commercial-grade thermal and power: Documented operating range (0 °C to 85 °C) and a defined core supply range (870 mV–930 mV) support predictable system integration and power budgeting.
  • RoHS compliant: Meets RoHS environmental requirements for streamlined regulatory compliance in standard commercial products.

Why Choose 5SGSMD3H1F35C2N?

This Stratix V GS device positions itself for designers who need a high-capacity, DSP-optimized FPGA with integrated high-speed serial I/O and substantial embedded memory. Its combination of logic density, DSP resources, and transceiver capability makes it well suited for communications, broadcast, test, and compute-acceleration designs where on-chip performance and integration reduce system complexity.

For teams building bandwidth- and compute-intensive systems, the 5SGSMD3H1F35C2N provides a commercially graded, RoHS-compliant solution that maps complex algorithms and high-speed interfaces into a single 1152-ball FCBGA package.

If you need pricing or availability for 5SGSMD3H1F35C2N, request a quote or submit an inquiry for expedited handling and supply information.

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